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The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.", "value": { "amount": 1900000, "currency": "GBP" }, "lots": [ { "id": "1", "description": "NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing", "status": "cancelled", "awardCriteria": { "criteria": [ { "name": "Quality", "type": "quality", "description": "70" }, { "type": "price", "description": "30" } ] }, "contractPeriod": { "durationInDays": 660 }, "hasRenewal": false, "submissionTerms": { "variantPolicy": "notAllowed" }, "hasOptions": true, "options": { "description": "The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations." } } ], "items": [ { "id": "1", "additionalClassifications": [ { "scheme": "CPV", "id": "31710000", "description": "Electronic equipment" } ], "deliveryAddresses": [ { "region": "UKM82" }, { "region": "UKM82" }, { "region": "UKM82" } ], "relatedLot": "1" } ], "communication": { "futureNoticeDate": "2023-10-02T00:00:00+01:00", "atypicalToolUrl": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html" }, "coveredBy": [ "GPA" ], "submissionMethod": [ "electronicSubmission" ], "submissionMethodDetails": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html", "selectionCriteria": { "criteria": [ { "type": "economic", "description": "4B 1.2 Turnover Bidders will be required to have an average yearly turnover of a minimum of 3,000,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain", "minimum": "4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. 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