{ "tag": [ "compiled" ], "id": "ocds-h6vhtk-040425-2024-01-05T16:06:33Z", "date": "2024-01-05T16:06:33Z", "ocid": "ocds-h6vhtk-040425", "description": "The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any selection of tenderers will be based solely on the criteria set out for the procurement. Procurement Contract Transparency Data: Redacted contract documents will be made available within the next 30 days on the UKRI website at: https://www.ukri.org/about-us/procurement-contract-transparency-data/ To view this notice, please click here: https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=833356262 GO Reference: GO-202415-PRO-24908448", "initiationType": "tender", "tender": { "id": "UKRI-3154", "legalBasis": { "id": "32014L0024", "scheme": "CELEX" }, "title": "UKRI-3154 Indium deposition system", "status": "complete", "classification": { "scheme": "CPV", "id": "14763000", "description": "Indium" }, "mainProcurementCategory": "goods", "description": "STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.", "value": { "amount": 320000, "currency": "GBP" }, "lots": [ { "id": "1", "description": "STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.", "value": { "amount": 320000, "currency": "GBP" }, "contractPeriod": { "durationInDays": 360 }, "hasRenewal": false, "submissionTerms": { "variantPolicy": "notAllowed" }, "hasOptions": false, "status": "cancelled", "awardCriteria": { "criteria": [ { "name": "Quality", "type": "quality", "description": "70" }, { "name": "Price", "type": "cost", "description": "30" } ] } } ], "items": [ { "id": "1", "deliveryAddresses": [ { "region": "UKJ14" }, { "region": "UKJ14" } ], "deliveryLocation": { "description": "Oxfordshire" }, "relatedLot": "1" } ], "submissionMethod": [ "electronicSubmission", "written" ], "submissionMethodDetails": "https://www.delta-esourcing.com/tenders/UK-title/2J2786X87G", "documents": [ { "id": "economic", "documentType": "economicSelectionCriteria" }, { "id": "technical", "documentType": "technicalSelectionCriteria" } ], "procurementMethod": "open", "procurementMethodDetails": "Open procedure", "coveredBy": [ "GPA" ], "tenderPeriod": { "endDate": "2023-11-02T14:00:00Z" }, "submissionTerms": { "languages": [ "en" ], "bidValidityPeriod": { "durationInDays": 90 } }, "awardPeriod": { "startDate": "2023-11-02T14:00:00Z" }, "bidOpening": { "date": "2023-11-02T14:00:00Z" }, "hasRecurrence": false, "contractTerms": { "hasElectronicOrdering": true, "electronicInvoicingPolicy": "allowed", "hasElectronicPayment": true } }, "parties": [ { "id": "GB-FTS-93510", "name": "UK Research & Innovation", "identifier": { "legalName": "UK Research & Innovation" }, "address": { "streetAddress": "https://www.ukri.org, North Star Avenue, Harwell", "locality": "Swindon", "region": "UKK14", "postalCode": "SN2 1FL", "countryName": "United Kingdom" }, "contactPoint": { "name": "Declan Ward", "telephone": "+44 1793442000", "email": "commercial@ukri.org", "url": "https://www.delta-esourcing.com/tenders/UK-UK-Swindon:-Indium./2J2786X87G" }, "roles": [ "buyer" ], "details": { "url": "https://www.ukri.org", "classifications": [ { "scheme": "TED_CA_TYPE", "id": "BODY_PUBLIC", "description": "Body governed by public law" }, { "scheme": "COFOG", "description": "Research and innovation" } ] } }, { "id": "GB-FTS-34029", "name": "UK Research and Innovation", "identifier": { "legalName": "UK Research and Innovation" }, "address": { "streetAddress": "Polaris House,, North Star Avenue", "locality": "Swindon", "postalCode": "SN2 1FL", "countryName": "United Kingdom" }, "contactPoint": { "email": "commercial@ukri.org" }, "roles": [ "reviewBody", "mediationBody" ] }, { "id": "GB-FTS-101831", "name": "HHV Ltd", "identifier": { "legalName": "HHV Ltd", "id": "06738557" }, "address": { "streetAddress": "Unit 14 Lloyds Court", "locality": "Crawley", "region": "UKJ14", "postalCode": "RH10 9QX", "countryName": "United Kingdom" }, "roles": [ "supplier" ], "details": { "scale": "sme" } } ], "buyer": { "id": "GB-FTS-93510", "name": "UK Research & Innovation" }, "language": "en", "awards": [ { "id": "000402-2024-UKRI-3154-1", "relatedLots": [ "1" ], "title": "Indium deposition system", "status": "active", "suppliers": [ { "id": "GB-FTS-101831", "name": "HHV Ltd" } ] } ], "contracts": [ { "id": "000402-2024-UKRI-3154-1", "awardID": "000402-2024-UKRI-3154-1", "title": "Indium deposition system", "status": "active", "value": { "amount": 185067, "currency": "GBP" }, "dateSigned": "2023-12-20T00:00:00Z" } ], "bids": { "statistics": [ { "id": "1", "measure": "bids", "relatedLot": "1", "value": 3 } ] } }