{ "tag": [ "compiled" ], "id": "ocds-h6vhtk-047100-2025-01-16T08:21:37Z", "date": "2025-01-16T08:21:37Z", "ocid": "ocds-h6vhtk-047100", "description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 26821. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ A summary of the expected community benefits has been provided as follows: Please see Procurement documents for full details (SC Ref:787967)", "initiationType": "tender", "tender": { "id": "UOS-30411-2024", "legalBasis": { "id": "32014L0024", "scheme": "CELEX" }, "title": "Supply, Delivery and Installation of wafer dicing kit for NMIS", "status": "complete", "classification": { "scheme": "CPV", "id": "31712330", "description": "Semiconductors" }, "mainProcurementCategory": "goods", "description": "The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.", "value": { "amount": 1000000, "currency": "GBP" }, "lots": [ { "id": "1", "title": "Saw Dicing", "description": "The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 1 - Saw Dicing", "awardCriteria": { "criteria": [ { "name": "quality", "type": "quality", "description": "50" }, { "type": "price", "description": "50" } ] }, "contractPeriod": { "durationInDays": 540 }, "hasRenewal": false, "submissionTerms": { "variantPolicy": "notAllowed" }, "hasOptions": true, "options": { "description": "The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations." }, "status": "active" }, { "id": "2", "title": "Laser Dicing", "description": "The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 2 - Laser Dicing", "awardCriteria": { "criteria": [ { "name": "quality", "type": "quality", "description": "50" }, { "type": "price", "description": "50" } ] }, "contractPeriod": { "durationInDays": 540 }, "hasRenewal": false, "submissionTerms": { "variantPolicy": "notAllowed" }, "hasOptions": true, "options": { "description": "The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations." }, "status": "active" }, { "id": "3", "title": "Scribe & Break", "description": "The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 3 - Scribe & Break", "awardCriteria": { "criteria": [ { "name": "quality", "type": "quality", "description": "50" }, { "type": "price", "description": "50" } ] }, "contractPeriod": { "durationInDays": 540 }, "hasRenewal": false, "submissionTerms": { "variantPolicy": "notAllowed" }, "hasOptions": true, "options": { "description": "The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations." }, "status": "cancelled" } ], "items": [ { "id": "1", "additionalClassifications": [ { "scheme": "CPV", "id": "31712330", "description": "Semiconductors" } ], "deliveryAddresses": [ { "region": "UKM82" } ], "deliveryLocation": { "description": "University of Strathclyde" }, "relatedLot": "1" }, { "id": "2", "additionalClassifications": [ { "scheme": "CPV", "id": "31712330", "description": "Semiconductors" } ], "deliveryAddresses": [ { "region": "UKM82" } ], "relatedLot": "2" }, { "id": "3", "additionalClassifications": [ { "scheme": "CPV", "id": "31712330", "description": "Semiconductors" } ], "deliveryAddresses": [ { "region": "UKM82" }, { "region": "UKM82" } ], "relatedLot": "3" } ], "submissionMethod": [ "electronicSubmission" ], "submissionMethodDetails": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/toolkit/dashboard/dashboard.do?_ncp=1718717323289.17229-1", "communication": { "atypicalToolUrl": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/toolkit/dashboard/dashboard.do?_ncp=1718717323289.17229-1" }, "selectionCriteria": { "criteria": [ { "type": "economic", "description": "4B 1.2 Turnover Bidders will be required to have the average yearly turnover to participate in the relevant lot (see below) This is to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain. Lot 1 - GBP 600,000 for the last 3 (three) years Lot 2 - GBP 2,000,000 for the last 3 (three) years Lot 3 - GBP 1,600,000 for the last 3 (three) years", "minimum": "4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below: The Contractor shall maintain in force with reputable insurers Employer's (Compulsory) Liability Insurance = GBP 10m Public and Product Liability Insurance = GBP 10m Professional Risk Indemnity Insurance = GBP 1m In respect of any one incident and unlimited as to numbers of claims", "appliesTo": [ "supplier" ] }, { "type": "technical", "description": "4C.1.2 Previous Experience Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice.", "appliesTo": [ "supplier" ] } ] }, "procurementMethod": "open", "procurementMethodDetails": "Open procedure", "coveredBy": [ "GPA" ], "tenderPeriod": { "endDate": "2024-07-22T12:00:00+01:00" }, "submissionTerms": { "languages": [ "en" ], "bidValidityPeriod": { "durationInDays": 120 } }, "awardPeriod": { "startDate": "2024-07-22T12:00:00+01:00" }, "bidOpening": { "date": "2024-07-22T12:00:00+01:00", "address": { "streetAddress": "University of Strathclyde" } }, "hasRecurrence": false, "contractTerms": { "hasElectronicOrdering": true, "electronicInvoicingPolicy": "allowed", "hasElectronicPayment": true }, "reviewDetails": "An economic operator that suffers, or risks suffering, loss or damage attributable to a breach of duty under the Public Contracts (Scotland) Regulations 2015(SSI2015/446) (as amended) may bring proceedings in the Sheriff Court or the Court of Session." }, "parties": [ { "id": "GB-FTS-73570", "name": "University of Strathclyde", "identifier": { "legalName": "University of Strathclyde" }, "address": { "streetAddress": "McCance Building, 16 Richmond Street", "locality": "Glasgow", "region": "UKM82", "postalCode": "G1 1XQ", "countryName": "United Kingdom" }, "contactPoint": { "telephone": "+44 7811592949", "email": "jen.robertson@strath.ac.uk", "url": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html" }, "roles": [ "buyer", "centralPurchasingBody" ], "details": { "url": "http://www.strath.ac.uk/", "buyerProfile": "https://www.publiccontractsscotland.gov.uk/search/Search_AuthProfile.aspx?ID=AA00113", "classifications": [ { "scheme": "TED_CA_TYPE", "id": "BODY_PUBLIC", "description": "Body governed by public law" }, { "scheme": "COFOG", "id": "09", "description": "Education" } ] } }, { "id": "GB-FTS-220", "name": "Glasgow Sheriff Court", "identifier": { "legalName": "Glasgow Sheriff Court" }, "address": { "locality": "Glasgow", "countryName": "United Kingdom" }, "roles": [ "reviewBody" ] }, { "id": "GB-FTS-135190", "name": "S3 Alliance Ltd", "identifier": { "legalName": "S3 Alliance Ltd" }, "address": { "streetAddress": "Skeoge Industrial Estate, Beraghmore Road", "locality": "Derry", "region": "UKN", "postalCode": "BT48 8SE", "countryName": "United Kingdom" }, "roles": [ "supplier" ], "details": { "scale": "sme" } } ], "buyer": { "id": "GB-FTS-73570", "name": "University of Strathclyde" }, "links": [ { "rel": "canonical", "href": "https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000769827" } ], "language": "en", "awards": [ { "id": "001435-2025-1", "relatedLots": [ "3" ], "title": "Scribe & Break", "status": "active", "suppliers": [ { "id": "GB-FTS-135190", "name": "S3 Alliance Ltd" } ] } ], "contracts": [ { "id": "001435-2025-1", "awardID": "001435-2025-1", "title": "Scribe & Break", "status": "active", "value": { "amount": 305414, "currency": "GBP" }, "dateSigned": "2024-12-04T00:00:00Z" } ], "bids": { "statistics": [ { "id": "1", "measure": "bids", "relatedLot": "3", "value": 2 }, { "id": "2", "measure": "smeBids", "relatedLot": "3", "value": 2 }, { "id": "3", "measure": "foreignBidsFromEU", "relatedLot": "3", "value": 1 }, { "id": "4", "measure": "foreignBidsFromNonEU", "relatedLot": "3", "value": 1 }, { "id": "5", "measure": "electronicBids", "relatedLot": "3", "value": 2 } ] } }