{ "tag": [ "compiled" ], "id": "ocds-r6ebe6-0000800631-2025-08-26T22:20:32Z", "date": "2025-08-26T22:20:32Z", "ocid": "ocds-r6ebe6-0000800631", "initiationType": "tender", "parties": [ { "id": "org-1", "name": "Registers of Scotland", "address": { "streetAddress": "Meadowbank House", "locality": "Edinburgh", "postalCode": "EH8 7AU" }, "contactPoint": { "name": "Procurement", "email": "ranjit.bhatti@ros.gov.uk", "telephone": "+44 1314793610", "url": "http://www.ros.gov.uk" }, "roles": [ "buyer" ] }, { "id": "org-2", "name": "Venesky Brown Ltd", "address": { "streetAddress": "4a Rutland Square", "locality": "Edinburgh", "postalCode": "EH1 2AS" }, "contactPoint": { "name": "Chris Wallis" }, "roles": [ "supplier" ] }, { "id": "org-3", "name": "Harvey Nash Limited", "address": { "streetAddress": "Waverley Gate", "locality": "Edinburgh", "postalCode": "EH1 3EG" }, "contactPoint": { "name": "Graeme McNaull" }, "roles": [ "supplier" ] }, { "id": "org-4", "name": "Hays Specialist Recruitment 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"id": "org-12", "name": "Storrier & Donaldson Ltd", "address": { "streetAddress": "Pavilion 1 Finnieston Business Park,", "locality": "Glasgow", "postalCode": "G3 8AU" }, "contactPoint": { "name": "Daniel McKinney" }, "roles": [ "supplier" ] }, { "id": "org-13", "name": "Knoxfield Estate Services Ltd", "address": { "streetAddress": "Darachdal", "locality": "Burrelton", "postalCode": "PH13 9PP" }, "contactPoint": { "name": "Lewis Knox" }, "roles": [ "supplier" ] }, { "id": "org-14", "name": "Wylie Shanks Architects LLP", "address": { "streetAddress": "17 Royal Terrace", "locality": "Glasgow", "postalCode": "G3 7NY" }, "contactPoint": { "name": "Stephen Kerr" }, "roles": [ "supplier" ] }, { "id": "org-15", "name": "Harper Macleod LLP", "address": { "streetAddress": "The Ca'd'oro", "locality": "Glasgow", "postalCode": "G1 3PE" }, "contactPoint": { "name": "Martin Darroch" }, "roles": [ "supplier" ] }, { "id": "org-16", "name": "Falkirk Council", "address": { "streetAddress": "The Foundry", "locality": "Larbert", "postalCode": "FK5 4RU" }, "contactPoint": { "name": "Corporate Procurement Unit", "email": "cpu@falkirk.gov.uk", "telephone": "+44 1324506070", "url": "http://www.falkirk.gov.uk" }, "roles": [ "buyer" ] }, { "id": "org-17", "name": "Brewster Brothers Ltd", "address": { "streetAddress": "Drumshoreland Road", "locality": "Livingston", "postalCode": "EH53 0LG" }, "contactPoint": { "name": "Scott Brewster" }, "roles": [ "supplier" ] }, { "id": "org-18", "name": "University of Strathclyde", "address": { "streetAddress": "Learning & Teaching Building", "locality": "Glasgow", "postalCode": "G1 1XU" }, "contactPoint": { "name": "Procurement", "email": "anna.sanina@strath.ac.uk", "telephone": "+44 7811592949", "url": "http://www.strath.ac.uk/" }, "roles": [ "buyer" ] }, { "id": "org-19", "name": "POWATEC GmbH", "address": { "streetAddress": "Rothusstrasse 5a", "locality": "Hunenberg", "postalCode": "6631" }, "contactPoint": { "name": "Nicolas Gremaud" }, "roles": [ "supplier" ] } ], "buyer": { "name": "University of Strathclyde", "id": "org-18" }, "tender": { "id": "tender-808339", "title": "Award of Supply and Delivery of UV Curing System", "description": "The University of Strathclyde has a requirement for a bond-interconnect-package line that is suitable to receive semiconductor wafers and/or dies to be packaged in discrete power devices and modules. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a suitable UV curing system for use with taped wafers.", "mainProcurementCategory": "goods", "additionalClassifications": [ { "id": "71900000", "description": "Laboratory services", "scheme": "CPV" } ] }, "awards": [ { "id": "awd-1", "value": { "amount": 49600, "currency": "GBP" }, "suppliers": [ { "id": "org-19", "name": "POWATEC GmbH" } ], "items": [ { "id": "awditem-1", "description": "The University of Strathclyde has a requirement for a bond-interconnect-package line that is suitable to receive semiconductor wafers and/or dies to be packaged in discrete power devices and modules. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a suitable UV curing system for use with taped wafers." } ] } ], "contracts": [ { "id": "awd-1", "awardID": "awd-1", "status": "active" } ], "bids": { "statistics": [ { "id": "1", "measure": "bids", "value": 2 } ] }, "noticetype": "PCS Notice - Quick Quote Award" }