---
title: "Automated Multipurpose Wire Bonder"
ocid: "ocds-b5fd17-24f50554-0c3e-45a5-be8a-1b95356071b9"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-b5fd17-24f50554-0c3e-45a5-be8a-1b95356071b9"
markdown_url: "https://d3tenders.com/contract/ocds-b5fd17-24f50554-0c3e-45a5-be8a-1b95356071b9.md"
json_url: "https://d3tenders.com/contract/ocds-b5fd17-24f50554-0c3e-45a5-be8a-1b95356071b9.json"
source: "Contracts Finder"
current_stage: "Award"
buyer: "COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED"
published: "2019-07-26"
---

# Automated Multipurpose Wire Bonder

Buyer: COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED  
Current stage: Award  
OCID: ocds-b5fd17-24f50554-0c3e-45a5-be8a-1b95356071b9

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## Summary

The Compound Semiconductor Applications Catapult Limited, located in Cardiff, Wales, has initiated a procurement process for an "Automated Multipurpose Wire Bonder". This tender falls under the category of laboratory, optical, and precision equipment and has a tender value of £180,000. The procurement was conducted through an open procedure, with the tender period concluding on 7th May 2019. The contract is expected to start on 24th May 2019 and will extend until 23rd May 2022.

This procurement presents a significant opportunity for businesses specialising in advanced manufacturing and prototype development, particularly those engaged in the semiconductor or electronics sectors. Companies that can offer innovative solutions and advanced machinery for wire bonding, especially those with the capacity to support both manual and automated processes, would be well-suited to compete for this contract. The initiative aims to foster experimental development and proof-of-concept creation, making it ideal for businesses looking to expand their presence in cutting-edge technological fields.

## Notice

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform wire bonding from chips and modules on to substrates and PCB boards. The wire bonding equipment shall allow manual and automated bonding for experimentation and low volume prototype volume build. It shall be adaptable to wire bond a wide variety of components from chip level through to module level using organic- inorganics substrates and PCBs for all required package architecture required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions. The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation. The Catapult may also purchase additional, related services. Additional information: To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-026 in the subject field.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Contracts Finder |
| Latest notice | https://www.contractsfinder.service.gov.uk/Notice/c9dc3d0d-35d1-4c84-b8d1-e17409f27d82 |
| Notice type | Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure (above threshold) |
| Tender suitability | SME |
| Awardee scale | SME |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 26 Jul 2019 |
| Submission deadline | 7 May 2019 |
| Future notice date | Not specified |
| Award date | 25 Jun 2019 |
| Contract period | 26 Jun 2019 - 25 Jun 2022 |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £180,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Not specified |
| Awards status | Active |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED |
| Locality | CARDIFF |
| Post town | Cardiff |
| Postcode | CF10 4RU |
| Country | Wales |
| ITL 1 | TLL Wales |
| ITL 2 | TLL5 South East Wales |
| ITL 3 | TLL52 Cardiff and Vale of Glamorgan |
| Local authority | Cardiff |
| Electoral ward | Butetown |
| Westminster constituency | Cardiff South and Penarth |
| Delivery location | Not specified |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | ACCELONIX |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 26 Jul 2019 at 12:07 - AwardUpdate - Award Notice - https://www.contractsfinder.service.gov.uk/Notice/c9dc3d0d-35d1-4c84-b8d1-e17409f27d82
- 26 Jul 2019 at 10:15 - Award - Award Notice - https://www.contractsfinder.service.gov.uk/Notice/c9dc3d0d-35d1-4c84-b8d1-e17409f27d82
- 5 Apr 2019 at 10:35 - Tender - Tender Notice - https://www.contractsfinder.service.gov.uk/Notice/93c32157-efb0-45a7-ae1f-3a12f645a0b9

## Documents

- https://www.contractsfinder.service.gov.uk/Notice/c9dc3d0d-35d1-4c84-b8d1-e17409f27d82
  26th July 2019 - Awarded contract notice on Contracts Finder
- https://www.contractsfinder.service.gov.uk/Notice/93c32157-efb0-45a7-ae1f-3a12f645a0b9
  5th April 2019 - Opportunity notice on Contracts Finder

## Notice URLs

- https://csa.catapult.org.uk

## Provenance

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