--- title: "Sub-Micron Bonder" ocid: "ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a" markdown_url: "https://d3tenders.com/contract/ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a.md" json_url: "https://d3tenders.com/contract/ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a.json" source: "Contracts Finder" current_stage: "Tender" buyer: "COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED" published: "2020-07-14" --- # Sub-Micron Bonder Buyer: COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED Current stage: Tender OCID: ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a) [Download OCDS JSON](https://d3tenders.com/contract/ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a.json) ## Summary The Compound Semiconductor Applications Catapult Limited is currently seeking suppliers for the procurement of a "Sub-Micron Bonder" intended for their new prototype package assembly and test facility located in Newport, Wales. This tender is in the open procurement stage, with a deadline for submissions on 13th August 2020. The total value of the contract is estimated at £450,000, with a minimum value of £350,000. The related procurement method is open, aimed at acquiring goods specifically within the electronic equipment and laboratory equipment industries. This tender presents significant opportunities for businesses specialising in advanced manufacturing and high-precision assembly technologies. Companies capable of providing flexible, modular assembly machines that support micro-processing applications would be particularly well-suited to compete. Furthermore, suppliers prepared to offer installation, training, and ongoing maintenance for the equipment could enhance their competitive edge in this growing sector of the UK economy. ## Notice The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As part of the package assembly research and development methodology we require a machine to perform sub-micron die placement for several growth areas in compound semiconductor packaging. This machine shall be capable of handling very small die in applications where their precision placement is a high priority; typical examples of this are micro LED's, laser diode assembly, micro optics assembly, VCSEL, photo diode arrays, III-V semiconductor die attachment to ROIC (hybridisation) and image sensor assembly. This shall also support future technology growth areas in packaging such as 2.5D and 3D IC packaging, multi-chip modules, flex on board and chip on glass. Capability to have optional upgrades, such as integration of active alignment for photonics device assembly would be advantageous. The equipment shall be flexible and have several technologies available to mount die onto a substrate: dispensing, sintering, thermocompression bonding UV curing and ultrasonic bonding. Other process modules to support die placement and processing would include die heating and substrate heating, a process gas module for applications like formic acid etching for low temperature bumping, mechanical handling of parts and a module to support high bonding forces. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support The system architecture is expected to be a standalone machine with a number of modules and tool options to allow the micro assembly of die with a sub-micron placement accuracy. The system shall provide user-controlled interface for the assembly of die into devices for RF, Photonics and Power packaging. The system should have capability to be used for both prototype device and low volume production quantities. The system shall be easy to configure and change for the user to allow different processes. A system solution is required that is flexible and upgradeable in the future. Additional module options can then be purchased based on changing industry trends or specific requirements from customers or partners for technology development. The system should also include user software, installation, and training. Additional information: Please note that the equipment will be required to be delivered to the laboratory in Newport, Wales, by the end of December 2020. To express interest in this requirement and receive the tender documents, please email procurement@csa.catapult.org.uk with the reference ITC-2020-037 in the subject field. ## Key Details | Field | Value | | --- | --- | | Publication source | Contracts Finder | | Latest notice | https://www.contractsfinder.service.gov.uk/Notice/cc87ecec-23a4-46ba-8101-01fb90143951 | | Notice type | Tender Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure (above threshold) | | Tender suitability | SME | | Awardee scale | Not specified | | All stages | Tender | ## Dates | Field | Value | | --- | --- | | Publication date | 14 Jul 2020 | | Submission deadline | 13 Aug 2020 | | Future notice date | Not specified | | Award date | Not specified | | Contract period | 18 Dec 2020 - 17 Dec 2023 | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £450,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Active | | Lots status | Not specified | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED | | Locality | NEWPORT | | Post town | Newport | | Postcode | NP10 8BE | | Country | Wales | | ITL 1 | TLL Wales | | ITL 2 | TLL5 South East Wales | | ITL 3 | TLL54 Monmouthshire and Newport | | Local authority | Newport | | Electoral ward | Tredegar Park and Marshfield | | Westminster constituency | Newport West and Islwyn | | Delivery location | Not specified | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 31710000 - Electronic equipment - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 14 Jul 2020 at 16:03 - Tender - Tender Notice - https://www.contractsfinder.service.gov.uk/Notice/cc87ecec-23a4-46ba-8101-01fb90143951 ## Documents - https://www.contractsfinder.service.gov.uk/Notice/cc87ecec-23a4-46ba-8101-01fb90143951 14th July 2020 - Opportunity notice on Contracts Finder ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. 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