---
title: "Laser Dicing and Drilling System"
ocid: "ocds-h6vhtk-02ac37"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-02ac37"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-02ac37.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-02ac37.json"
source: "Find A Tender Service"
current_stage: "Tender"
buyer: "COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED"
published: "2021-04-30"
---

# Laser Dicing and Drilling System

Buyer: COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED  
Current stage: Tender  
OCID: ocds-h6vhtk-02ac37

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## Summary

The Compound Semiconductor Applications Catapult is currently conducting a procurement process for a Laser Dicing and Drilling System, classified under laboratory, optical and precision equipment (excluding glasses) within the goods category. This open tender, identified as ICT-2021-047, is active and based in Newport, United Kingdom. The submission deadline for proposals is 1st June 2021, with an estimated contract value between £250,000 and £350,000. The successful system is anticipated to support small volume prototype builds for RF, photonics, and power semiconductor devices. Bid submissions must be made electronically via the provided submission details.

This tender presents significant opportunities for businesses specialising in precision engineering, manufacturing of semiconductor equipment, or those offering advanced laser technologies. Companies engaged in research and development of packaging solutions for high-tech industries would also benefit from participating. The project’s focus on flexibility, upgradability, and high-quality output aligns well with enterprises that have the capability to deliver innovative solutions in the semiconductor sector.

## Notice

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications. The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 20:1 (preferably 50:1 if applicable) with high-quality edge finish and minimum taper angle (preferably 90-degree cut). The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming. The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated. A system solution is required that is flexible and upgradable in the future. The estimated value of the contract is PS250,000 to PS350,000 including good to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of September delivered in October 2021.

### Lot Information

Lot 1

See tender specification. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-047 in the subject field.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/009414-2021 |
| Notice type | Tender Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 30 Apr 2021 |
| Submission deadline | 1 Jun 2021 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £350,000 |
| Lots value | £350,000 |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED |
| Locality | NEWPORT |
| Post town | Newport |
| Postcode | NP10 8BE |
| Country | Wales |
| ITL 1 | TLL Wales |
| ITL 2 | TLL5 South East Wales |
| ITL 3 | TLL54 Monmouthshire and Newport |
| Local authority | Newport |
| Electoral ward | Tredegar Park and Marshfield |
| Westminster constituency | Newport West and Islwyn |
| Delivery location | TLL Wales |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 30 Apr 2021 at 12:24 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/009414-2021

## Notice URLs

- https://csa.catapult.org.uk

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-02ac37. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-02ac37.json.