---
title: "Supply of Semiconductor Dicing and Grinding Systems"
ocid: "ocds-h6vhtk-02cb8f"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-02cb8f"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-02cb8f.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-02cb8f.json"
source: "Find A Tender Service"
current_stage: "Award"
buyer: "SWANSEA UNIVERSITY"
published: "2021-11-08"
---

# Supply of Semiconductor Dicing and Grinding Systems

Buyer: SWANSEA UNIVERSITY  
Current stage: Award  
OCID: ocds-h6vhtk-02cb8f

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## Summary

The procurement process involves Swansea University seeking tenders for the supply and installation of Semiconductor Dicing and Grinding Systems. This tender falls under the industry category of laboratory, optical and precision equipment, with a total estimated value of £350,000. The procurement is currently in the active tender stage with a submission deadline set for 24th August 2021. Deliveries are to be made to either the Swansea University Bay Campus or Newport Wafer Fab in Wales, United Kingdom, with an emphasis on reliable equipment to support extensive experimental work at the facility.

This tender presents significant opportunities for growth within the semiconductor manufacturing sector, particularly for businesses involved in the supply of high-precision laboratory equipment. Companies with capabilities in producing or installing wafer dicing and grinding systems would be particularly well-suited to compete for this contract. Additionally, firms that can ensure the reliability and quality of their equipment, in order to support critical research and experimental initiatives, will find valuable prospects in this procurement process.

## Notice

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots

### Lot Information

Wafer Dicing System

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.

Wafer Grinding System

This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/027974-2021 |
| Notice type | Tender Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 8 Nov 2021 |
| Submission deadline | 24 Aug 2021 |
| Future notice date | Not specified |
| Award date | 18 Oct 2021 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £350,000 |
| Lots value | £330,000 |
| Awards value | Not specified |
| Contracts value | £382,574 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Cancelled |
| Awards status | Active |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | SWANSEA UNIVERSITY |
| Locality | SWANSEA |
| Post town | Swansea |
| Postcode | SA2 8PP |
| Country | Wales |
| ITL 1 | TLL Wales |
| ITL 2 | TLL4 Mid and South West Wales |
| ITL 3 | TLL43 Swansea |
| Local authority | Swansea |
| Electoral ward | Sketty |
| Westminster constituency | Swansea West |
| Delivery location | TLL17 Bridgend and Neath Port Talbot, TLL18 Swansea, TLL21 Monmouthshire and Newport |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | DISCO HI-TEC |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 8 Nov 2021 at 15:35 - Award - Award Notice - https://www.find-tender.service.gov.uk/Notice/027974-2021
- 23 Jul 2021 at 08:05 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/017441-2021

## Notice URLs

- http://www.swansea.ac.uk
- https://etenderwales.bravosolution.co.uk/
- https://www.sell2wales.gov.wales/search/Search_AuthProfile.aspx?ID=AA0345

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-02cb8f. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-02cb8f.json.