---
title: "Laser Dicing and Drilling System"
ocid: "ocds-h6vhtk-02d648"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-02d648"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-02d648.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-02d648.json"
source: "Find A Tender Service"
current_stage: "Tender"
buyer: "COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED"
published: "2021-08-18"
---

# Laser Dicing and Drilling System

Buyer: COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED  
Current stage: Tender  
OCID: ocds-h6vhtk-02d648

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## Summary

The procurement process is being conducted by the Compound Semiconductor Applications Catapult Limited, with the tender titled "Laser Dicing and Drilling System." This contract falls within the industry category of laboratory, optical, and precision equipment, and the estimated value of the contract is between £250,000 and £350,000. The procurement method is an open procedure, currently at the tender stage, with the deadline for submissions set for 31st August 2021. The goods are to be delivered to Newport, United Kingdom, ideally by January 2022.

This tender presents significant opportunities for businesses in the fields of semiconductor manufacturing, optical equipment, and precision engineering. Companies that can supply advanced laser dicing and drilling systems are particularly well-suited to compete, particularly those offering supporting services such as installation and training. The requirement for high-quality, flexible, and upgradable equipment may also attract technology firms specialising in software development related to laser applications.

## Notice

Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications. The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 40:1 with high-quality edge finish and minimum taper angle (preferably 90-degree cut). The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming. System Outline The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated. A system solution is required that is flexible and upgradable in the future.

### Lot Information

Lot 1

The estimated value of the contract is PS250,000 to PS350,000 including goods to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of December 2021 delivered in January 2022. To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-053 in the subject field.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/020185-2021 |
| Notice type | Tender Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 18 Aug 2021 |
| Submission deadline | 31 Aug 2021 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £350,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED |
| Locality | NEWPORT |
| Post town | Newport |
| Postcode | NP10 8BE |
| Country | Wales |
| ITL 1 | TLL Wales |
| ITL 2 | TLL5 South East Wales |
| ITL 3 | TLL54 Monmouthshire and Newport |
| Local authority | Newport |
| Electoral ward | Tredegar Park and Marshfield |
| Westminster constituency | Newport West and Islwyn |
| Delivery location | TLL Wales |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 18 Aug 2021 at 11:13 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/020185-2021

## Notice URLs

- https://csa.catapult.org.uk/
- https://www.contractsfinder.service.gov.uk/Notice/f954559c-e6fd-4a8b-8af4-55eb23c84ddc

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-02d648. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-02d648.json.