---
title: "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment."
ocid: "ocds-h6vhtk-03f66f"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-03f66f"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-03f66f.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-03f66f.json"
source: "Find A Tender Service"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2024-07-03"
---

# NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-h6vhtk-03f66f

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## Summary

The University of Strathclyde has completed a procurement process to acquire equipment for its NMIS Power Electronics Advanced Packaging Semiconductor Facility. The focus is on acquiring equipment for die bonding, wire bonding, and encapsulation to support the expansion of manufacturing capabilities in the semiconductor sector. The procurement stage was cancelled, and the award was granted to Accelonix. The University is located in Glasgow, United Kingdom, and the industry category is semiconductors.

This tender by the University of Strathclyde offers business growth opportunities for companies specializing in electronic equipment within the semiconductor industry. The procurement method was an open procedure with award criteria focused on quality and price. The University set specific requirements for equipment to support a variety of semiconductor designs. Businesses capable of providing advanced packaging solutions tailored for power electronic semiconductors would be well-suited to compete for this contract.

## Notice

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

### Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/020273-2024 |
| Notice type | Planning Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | SME |
| All stages | Planning, Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 3 Jul 2024 |
| Submission deadline | 5 Feb 2024 |
| Future notice date | 1 Oct 2023 |
| Award date | 23 Jun 2024 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £1,900,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £1,963,564 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Cancelled |
| Awards status | Active |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1QE |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | ACCELONIX |

## CPV Codes

### Divisions

- 31 - Electrical machinery, apparatus, equipment and consumables; lighting

### Codes

- 31710000 - Electronic equipment
- 31712330 - Semiconductors

## Release History

- 3 Jul 2024 at 11:52 - Award - Award Notice - https://www.find-tender.service.gov.uk/Notice/020273-2024
- 20 Dec 2023 at 08:57 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/037383-2023
- 23 Aug 2023 at 15:15 - Planning - Planning Notice - https://www.find-tender.service.gov.uk/Notice/024848-2023

## Notice URLs

- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000753744
- https://www.publiccontractsscotland.gov.uk/search/Search_AuthProfile.aspx?ID=AA00113
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

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