---
title: "UKRI-3154 Indium deposition system"
ocid: "ocds-h6vhtk-040425"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-040425"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-040425.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-040425.json"
source: "Find A Tender Service"
current_stage: "Award"
buyer: "UK RESEARCH & INNOVATION"
published: "2024-01-05"
---

# UKRI-3154 Indium deposition system

Buyer: UK RESEARCH & INNOVATION  
Current stage: Award  
OCID: ocds-h6vhtk-040425

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## Summary

The UK Research & Innovation has completed a procurement process for an Indium deposition system under the goods category. The tender, titled "UKRI-3154 Indium deposition system", aimed to provide equipment capable of depositing on multiple substrates per day for the STFC Interconnect. The procurement stage was marked as "cancelled", with a contract value of 185,067 GBP signed on December 20, 2023. The tender was associated with the CPV code 14763000 for Indium and was open for business opportunities in the Oxfordshire region.

This tender by UK Research & Innovation presents a business growth opportunity for SMEs operating in the goods category, particularly those involved in electronic and detector assembly techniques. With a focus on providing advanced equipment for surface preparation and deposition processes, businesses specialised in semiconductor wafers and die production may find this tender suitable. The UKRI's procurement process, although marked as cancelled, reflects the organisation's commitment to driving innovation in scientific communities and external collaborations, potentially leading to future procurement opportunities in related fields.

## Notice

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

### Lot Information

Lot 1

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/000402-2024 |
| Notice type | Tender Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | SME |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 5 Jan 2024 |
| Submission deadline | 2 Nov 2023 |
| Future notice date | Not specified |
| Award date | 20 Dec 2023 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £320,000 |
| Lots value | £320,000 |
| Awards value | Not specified |
| Contracts value | £185,067 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Cancelled |
| Awards status | Active |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UK RESEARCH & INNOVATION |
| Locality | SWINDON |
| Post town | Swindon |
| Postcode | SN2 1FL |
| Country | England |
| ITL 1 | TLK South West (England) |
| ITL 2 | TLK7 Gloucestershire and Wiltshire |
| ITL 3 | TLK71 Swindon |
| Local authority | Swindon |
| Electoral ward | Rodbourne Cheney |
| Westminster constituency | Swindon North |
| Delivery location | TLJ14 Oxfordshire CC |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | HHV |

## CPV Codes

### Divisions

- 14 - Mining, basic metals and related products

### Codes

- 14763000 - Indium

## Release History

- 5 Jan 2024 at 16:06 - Award - Award Notice - https://www.find-tender.service.gov.uk/Notice/000402-2024
- 27 Sep 2023 at 11:07 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/028493-2023

## Notice URLs

- https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=833356262
- https://www.delta-esourcing.com/tenders/UK-UK-Swindon:-Indium./2J2786X87G
- https://www.delta-esourcing.com/tenders/UK-title/2J2786X87G
- https://www.ukri.org
- https://www.ukri.org,NorthStarAvenue,Harwell
- https://www.ukri.org/about-us/procurement-contract-transparency-data/

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-040425. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-040425.json.