---
title: "Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT"
ocid: "ocds-h6vhtk-0518c2"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-0518c2"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-0518c2.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-0518c2.json"
source: "Find A Tender Service"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2025-08-13"
---

# Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-h6vhtk-0518c2

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## Summary

The University of Strathclyde, located in Glasgow, is the contracting authority for the supply, delivery, installation, and commissioning of a Wafer Thinning Turnkey system. This procurement process, tagged under the CPV code 31712330 for semiconductors, is part of a broader initiative to establish an advanced packaging facility for power electronics at the National Manufacturing Institute Scotland. The procurement method employed is an open procedure, and the tender was conducted to align with the requirements set by the Public Contracts (Scotland) Regulations 2015. The procurement stage has moved through the tender phase with a deadline on the 20th June 2025 and has reached the award phase by August 2025, culminating in an active contract awarded to Disco Hi-Tech UK Ltd, valued at £1,005,000.

This tender offers significant business growth opportunities for companies involved in semiconductor technology, particularly those experienced in wafer processing. The project supports innovation in power electronics and is a notable opportunity for businesses within the UK and EU to engage with cutting-edge technology and infrastructure development. Companies with expertise in electronic equipment manufacturing and servicing, and those capable of meeting technical and financial specifications, such as having a turnover of at least £4,000,000 and relevant insurance policies, will find this contract advantageous for expanding their footprint in the semiconductor industry.

## Notice

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers

### Lot Information

Lot 1

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/048485-2025 |
| Notice type | Tender Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 13 Aug 2025 |
| Submission deadline | 20 Jun 2025 |
| Future notice date | Not specified |
| Award date | 29 Jul 2025 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £2,000,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £1,005,000 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Cancelled |
| Awards status | Active |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | DISCO HI-TECH |

## CPV Codes

### Divisions

- 31 - Electrical machinery, apparatus, equipment and consumables; lighting

### Codes

- 31710000 - Electronic equipment
- 31712330 - Semiconductors

## Release History

- 13 Aug 2025 at 14:38 - Award - Award Notice - https://www.find-tender.service.gov.uk/Notice/048485-2025
- 20 May 2025 at 12:42 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/023248-2025

## Notice URLs

- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000799129
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publiccontractsscotland.gov.uk/search/Search_AuthProfile.aspx?ID=AA00113
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-0518c2. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-0518c2.json.