---
title: "Sub-Micron Die Bonder"
ocid: "ocds-h6vhtk-05f213"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-05f213"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-05f213.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-05f213.json"
source: "Find A Tender Service"
current_stage: "Planning"
buyer: "UNIVERSITY OF SHEFFIELD"
published: "2025-12-09"
---

# Sub-Micron Die Bonder

Buyer: UNIVERSITY OF SHEFFIELD  
Current stage: Planning  
OCID: ocds-h6vhtk-05f213

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[Download OCDS JSON](https://d3tenders.com/contract/ocds-h6vhtk-05f213.json)

## Summary

The University of Sheffield, a public authority sub-central government body, is currently in the planning stage of a procurement process for a "Sub-Micron Die Bonder." This equipment is intended to support their work in Heterogeneous Integration for Microelectronics and Semiconductor Systems. The procurement falls under the goods category, specifically within laboratory, optical, and precision equipment, and is located in the UKE32 region of the United Kingdom. Indicative quotations were sought in November 2025, and a preliminary market engagement notice was published on 9th December 2025. The procurement process is still in the planning phase with future notice anticipated to be released on 16th December 2025. The estimated contract value is £380,000, with a planned contract period from 2nd March 2026 to 31st March 2026.

This tender offers significant opportunities for businesses engaged in providing advanced semiconductor equipment. The contract is especially suitable for small and medium-sized enterprises (SMEs) and voluntary, community, and social enterprises (VCSEs) with expertise in die bonding technologies. Companies capable of delivering a range of semiconductor bonding solutions, such as die to wafer and wafer to wafer bonding, would be well-positioned to compete. Engaging in this procurement can provide a platform for business growth through collaboration with a prestigious university, potentially leading to further research and development opportunities.

## Notice

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

### Planning Information

Indicative quotations for budgetary purposes, were sought from two potential providers in November 2025, by one of the academic members of staff team at the University.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/081169-2025 |
| Notice type | UK2 - Preliminary Market Engagement Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Not Specified |
| Procurement method details | Not specified |
| Tender suitability | SME, VCSE |
| Awardee scale | Not specified |
| All stages | Planning |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 9 Dec 2025 |
| Submission deadline | Not specified |
| Future notice date | 16 Dec 2025 |
| Award date | Not specified |
| Contract period | 2 Mar 2026 - 31 Mar 2026 |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £380,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Planning |
| Lots status | Planning |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF SHEFFIELD |
| Locality | SHEFFIELD |
| Post town | Sheffield |
| Postcode | S10 2TN |
| Country | England |
| ITL 1 | TLE Yorkshire and The Humber |
| ITL 2 | TLE3 South Yorkshire |
| ITL 3 | TLE32 Sheffield |
| Local authority | Sheffield |
| Electoral ward | Broomhill and Sharrow Vale |
| Westminster constituency | Sheffield Central |
| Delivery location | TLE32 Sheffield |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 9 Dec 2025 at 16:09 - Planning - UK2 - Preliminary Market Engagement Notice - https://www.find-tender.service.gov.uk/Notice/081169-2025

## Documents

- https://www.find-tender.service.gov.uk/Notice/081169-2025
  9th December 2025 - Preliminary market engagement notice on Find a Tender

## Notice URLs

- https://www.legislation.gov.uk/ukpga/2023/54/contents
- https://www.sheffield.ac.uk/

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-05f213. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-05f213.json.