---
title: "Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder"
ocid: "ocds-h6vhtk-06d9a5"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-h6vhtk-06d9a5"
markdown_url: "https://d3tenders.com/contract/ocds-h6vhtk-06d9a5.md"
json_url: "https://d3tenders.com/contract/ocds-h6vhtk-06d9a5.json"
source: "Find A Tender Service"
current_stage: "Tender"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2026-08-03"
---

# Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Tender  
OCID: ocds-h6vhtk-06d9a5

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## Summary

The University of Strathclyde is currently in the tender stage of procuring the supply, delivery, installation, and commissioning of a Submicron Flip-Chip Die Bonder, as part of its initiative to enhance the UK's semiconductor packaging capabilities. This procurement falls under the industry category of 'Laboratory, optical and precision equipment' and is classified within the CPV under the code 38000000. This open procedure tender, identified by project code 32464, is being managed electronically through PCS-Tender. Interested parties have until 4th September 2026 to submit their bids. The tender invites submissions in English, and selected tenders will commence on the same date as the bid opening, 4th September 2026, in Glasgow, Scotland, at the address of the University of Strathclyde.

This tender presents a significant opportunity for businesses operating within the semiconductor packaging and photonics sector, particularly those with experience in die attachment and flip chip bonding technologies. The contract requires capabilities for advanced hermetic sealing, making it a strategic project for suppliers who wish to play a key role in establishing a domestic supply chain in the UK, essential for reducing time-to-market and mitigating geopolitical risks. It is well-suited for companies that can demonstrate a stable financial background, with an average annual turnover of at least GBP 2,384,000 for three preceding years, and robust insurance coverage. Opportunities for additional deliveries or extensions could be further explored, providing growth potential for successful tenderers who can uphold high standards of quality and price competitiveness.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an automatic submicron flip-chip die bonder capable of performing die attachment and flip chip bonding for photonics packaging application.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Find A Tender Service |
| Latest notice | https://www.find-tender.service.gov.uk/Notice/073039-2026 |
| Notice type | Tender Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 3 Aug 2026 |
| Submission deadline | 4 Sep 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 3 Aug 2026 at 09:18 - Tender - Tender Notice - https://www.find-tender.service.gov.uk/Notice/073039-2026

## Notice URLs

- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000838764
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publiccontractsscotland.gov.uk/search/Search_AuthProfile.aspx?ID=AA00113
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-h6vhtk-06d9a5. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-h6vhtk-06d9a5.json.