---
title: "Supply of Semiconductor Dicing and Grinding Systems"
ocid: "ocds-kuma6s-112575"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-kuma6s-112575"
markdown_url: "https://d3tenders.com/contract/ocds-kuma6s-112575.md"
json_url: "https://d3tenders.com/contract/ocds-kuma6s-112575.json"
source: "Sell2Wales"
current_stage: "Award"
buyer: "SWANSEA UNIVERSITY"
published: "2021-11-08"
---

# Supply of Semiconductor Dicing and Grinding Systems

Buyer: SWANSEA UNIVERSITY  
Current stage: Award  
OCID: ocds-kuma6s-112575

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[Download OCDS JSON](https://d3tenders.com/contract/ocds-kuma6s-112575.json)

## Summary

Swansea University is seeking suppliers for the "Supply of Semiconductor Dicing and Grinding Systems", part of the education sector, based in Swansea, UK. The procurement is currently at the Award stage, with key contracts valued at £103,982 for the Wafer Dicing System and £278,592 for the Wafer Grinding System, both signed on 19 October 2021. These systems are crucial for enhancing the capabilities of their research facility, with delivery set for locations determined prior to shipment.

This tender presents an excellent opportunity for businesses that specialise in high-precision machinery and systems, particularly in the semiconductor industry. Companies that can provide top-tier technical solutions and exhibit strong reliability in their products are encouraged to participate. Suppliers with experience in similar contracts or those focused on innovative production techniques would be well-suited to compete for this contract, especially with procurement funded via the Driving the Electric Revolution Programme through Innovate UK.

## Notice

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots

### Lot Information

Wafer Dicing System

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.. Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.

Wafer Grinding System

This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.. Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Sell2Wales |
| Latest notice | https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=112575 |
| Notice type | OJEU - F3 - Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 8 Nov 2021 |
| Submission deadline | Not specified |
| Future notice date | Not specified |
| Award date | 19 Oct 2021 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £382,574 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | SWANSEA UNIVERSITY |
| Locality | SWANSEA |
| Post town | Swansea |
| Postcode | SA2 8PP |
| Country | Wales |
| ITL 1 | TLL Wales |
| ITL 2 | TLL4 Mid and South West Wales |
| ITL 3 | TLL43 Swansea |
| Local authority | Swansea |
| Electoral ward | Sketty |
| Westminster constituency | Swansea West |
| Delivery location | TLL17 Bridgend and Neath Port Talbot, TLL18 Swansea, TLL21 Monmouthshire and Newport |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | DISCO HI-TEC |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 8 Nov 2021 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=112575

## Documents

- https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=NOV378925
  Supply of Semiconductor Dicing and Grinding Systems - This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots

## Notice URLs

- https://api.sell2wales.gov.wales/v1?lang=cy/Notice?id=ocds-kuma6s-112575
- https://www.swansea.ac.uk

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-kuma6s-112575. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-kuma6s-112575.json.