--- title: "Chip Cleave & Break system" ocid: "ocds-kuma6s-124353" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-kuma6s-124353" markdown_url: "https://d3tenders.com/contract/ocds-kuma6s-124353.md" json_url: "https://d3tenders.com/contract/ocds-kuma6s-124353.json" source: "Sell2Wales" current_stage: "Award" buyer: "CARDIFF UNIVERSITY" published: "2023-02-27" --- # Chip Cleave & Break system Buyer: CARDIFF UNIVERSITY Current stage: Award OCID: ocds-kuma6s-124353 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-kuma6s-124353) [Download OCDS JSON](https://d3tenders.com/contract/ocds-kuma6s-124353.json) ## Summary Cardiff University has completed a procurement process for the acquisition of a Chip Cleave & Break system. The system is intended for use with Electronic and Optoelectronic devices across various material platforms. The procurement was conducted using an open procedure and has resulted in an active contract with S3-Alliance Ltd worth £278,000. The Chip Cleave & Break system project falls under the goods category and was awarded to S3-Alliance Ltd. The tender process was initiated on 27th February 2023 by Cardiff University. The tender for the Chip Cleave & Break system by Cardiff University presents significant business opportunities, especially for SMEs in the technology and engineering sectors. Companies offering innovative tools and solutions for electronic device processing are well-suited to compete in this tender. The allocated contract value of £278,000 indicates a substantial business growth potential for the successful supplier, S3-Alliance Ltd. The procurement method chosen enables fair competition and transparency in the selection process, fostering a competitive business environment. ## Notice The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool ### Lot Information Lot 1 The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool ## Key Details | Field | Value | | --- | --- | | Publication source | Sell2Wales | | Latest notice | https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=124353 | | Notice type | OJEU - F3 - Contract Award Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure | | Tender suitability | Not specified | | Awardee scale | SME | | All stages | Tender, Award | ## Dates | Field | Value | | --- | --- | | Publication date | 27 Feb 2023 | | Submission deadline | 26 Sep 2022 | | Future notice date | Not specified | | Award date | 23 Feb 2023 | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £200,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | £278,000 | ## Status | Field | Value | | --- | --- | | Tender status | Complete | | Lots status | Complete | | Awards status | Not specified | | Contracts status | Active | ## Buyer | Field | Value | | --- | --- | | Main buyer | CARDIFF UNIVERSITY | | Locality | CARDIFF | | Post town | Cardiff | | Postcode | CF24 0DE | | Country | Wales | | ITL 1 | TLL Wales | | ITL 2 | TLL5 South East Wales | | ITL 3 | TLL52 Cardiff and Vale of Glamorgan | | Local authority | Cardiff | | Electoral ward | Adamsdown | | Westminster constituency | Cardiff East | | Delivery location | TLL22 Cardiff and Vale of Glamorgan | ## Supplier | Field | Value | | --- | --- | | Number of suppliers | 1 | | Supplier names | S3-ALLIANCE | ## CPV Codes ### Divisions - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 27 Feb 2023 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=124353 - 26 Aug 2022 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.sell2wales.gov.wales/search/search_switch.aspx?ID=124353 ## Documents - https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=AUG409828 Chip Cleave & Break system - The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool - https://www.sell2wales.gov.wales/search/show/search_view.aspx?ID=MAR429421 Chip Cleave & Break system - The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool ## Notice URLs - http://www.cardiff.ac.uk/business/why-work-with-us/for-suppliers - https://api.sell2wales.gov.wales/v1?lang=cy/Notice?id=ocds-kuma6s-124353 - https://in-tendhost.co.uk/cardiffuniversity/aspx/Home ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-kuma6s-124353. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-kuma6s-124353.json.