---
title: "Supply, Delivery and Installation of a Wafer Dicing Saw"
ocid: "ocds-r6ebe6-0000570660"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000570660"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000570660.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000570660.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2019-03-06"
---

# Supply, Delivery and Installation of a Wafer Dicing Saw

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-r6ebe6-0000570660

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[Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000570660.json)

## Summary

The University of Strathclyde is conducting a public procurement process for the supply, delivery, and installation of a wafer dicing saw, primarily intended for dicing 150 mm diameter wafer stacks of glass and silicon. This tender falls under the goods category within the education industry sector, and is taking place in Glasgow, UK. The open procedure for bids was active until 4th February 2019, leading to the award of the contract to Disco Hi-Tech UK Ltd on 1st March 2019, with a total value of £57,000.

This procurement presents significant opportunities for businesses within the equipment supply and installation sectors, particularly those specialising in educational or scientific instruments. Companies capable of meeting the required turnover of at least £80,000 over the past three years, as well as those equipped with the necessary insurance qualifications, are well-suited to compete. Additionally, businesses that can demonstrate relevant experience in delivering similar supplies and services will find this tender aligned with their expertise, potentially facilitating growth through collaboration with a notable academic institution.

## Notice

The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.

### Lot Information

Lot 1

The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer either intended as partial replacement of supplies or installations or as the extension of existing supplies and installations. The Contracting Authority may at its sole discretion exercise this option.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR347431 |
| Notice type | PCS Notice - Website Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 6 Mar 2019 |
| Submission deadline | 4 Feb 2019 |
| Future notice date | Not specified |
| Award date | 1 Mar 2019 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £55,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £57,000 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1QE |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 2 |
| Supplier names | DISCO HI-TECH; UNIVERSITY OF STRATHCLYDE |

## CPV Codes

### Divisions

- 51 - Installation services (except software)

### Codes

- 51430000 - Installation services of laboratory equipment

## Release History

- 6 Mar 2019 at 00:00 - Award - PCS Notice - Website Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR347431
- 21 Jan 2019 at 00:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN342558

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN342558
  Supply, Delivery and Installation of a Wafer Dicing Saw - The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR347431
  Supply, Delivery and Installation of a Wafer Dicing Saw - The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.

## Notice URLs

- http://
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000570660
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000570660. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000570660.json.