---
title: "Wafer Dicing Saw"
ocid: "ocds-r6ebe6-0000728982"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000728982"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000728982.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000728982.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF ST ANDREWS"
published: "2023-05-30"
---

# Wafer Dicing Saw

Buyer: UNIVERSITY OF ST ANDREWS  
Current stage: Award  
OCID: ocds-r6ebe6-0000728982

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## Summary

The University of St Andrews has awarded a contract for a Wafer Dicing Saw to DISCO HI-TEC EUROPE GmbH. The procurement process was completed on 26th May 2023. The University, located in Guardbridge, UK, in the Education industry category, initiated a tender with a detailed description of the required saw capabilities for cutting various substrates. The procurement method for this goods contract was an open procedure.

This tender for a Wafer Dicing Saw by the University of St Andrews presents an opportunity for suppliers with expertise in cutting glass, quartz, sapphire, silicon, and SiC substrates. Businesses with a large-scale operation, especially those in the technology or manufacturing sectors, would be well-suited to compete. The process involved multiple bids, with a focus on electronic submissions, leading to a successful contract award to DISCO HI-TEC EUROPE GmbH.

## Notice

Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.

### Lot Information

Lot 1

Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY479728 |
| Notice type | PCS Notice - Website Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 30 May 2023 |
| Submission deadline | 26 Apr 2023 |
| Future notice date | Not specified |
| Award date | 26 May 2023 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £67,000 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF ST ANDREWS |
| Locality | GUARDBRIDGE |
| Post town | Kirkcaldy |
| Postcode | KY16 0US |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM0 Eastern Scotland |
| ITL 3 | TLM01 Clackmannanshire and Fife |
| Local authority | Fife |
| Electoral ward | Tay Bridgehead |
| Westminster constituency | North East Fife |
| Delivery location | TLM72 Clackmannanshire and Fife |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | DISCO HI-TEC EUROPE |

## CPV Codes

### Divisions

- 43 - Machinery for mining, quarrying, construction equipment

### Codes

- 43812000 - Sawing equipment

## Release History

- 30 May 2023 at 00:00 - Award - PCS Notice - Website Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY479728
- 12 Apr 2023 at 00:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR476026

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR476026
  Wafer Dicing Saw - Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY479728
  Wafer Dicing Saw - Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.

## Notice URLs

- http://
- http://www.st-andrews.ac.uk/staff/money/procurement/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000728982
- https://in-tendhost.co.uk/universityofstandrews/aspx/Home
- https://www.st-andrews.ac.uk/media/procurement/supplier-registration-portal.pdf

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000728982. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000728982.json.