--- title: "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment." ocid: "ocds-r6ebe6-0000742450" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000742450" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000742450.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000742450.json" source: "Public Contracts Scotland" current_stage: "Planning" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2023-08-23" --- # NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Planning OCID: ocds-r6ebe6-0000742450 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000742450) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000742450.json) ## Summary The University of Strathclyde based in Glasgow, UK, is planning a tender for the NMIS Power Electronics Advanced Packaging Semiconductor Facility. The procurement process is at the planning stage with a future notice date of 2nd October 2023. The project falls under the education industry category and involves a planned expenditure of £1,900,000 for goods. The University seeks to procure equipment for die bonding, wire bonding, and encapsulation to expand its manufacturing capabilities. This tender by the University of Strathclyde presents an opportunity for businesses in the semiconductor equipment industry to provide the required technology and expertise. Companies specializing in power electronic semiconductor designs, manufacturing equipment, and packaging solutions would be well-suited to compete for this tender. The tender process is essential for suppliers who can deliver and commission advanced equipment for die bonding, wire bonding, and encapsulation as part of the University's research and development activities. ## Notice NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required. ### Lot Information Lot 1 NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG486653 | | Notice type | OJEU - F1 - Prior Information Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Not Specified | | Procurement method details | Not specified | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Planning | ## Dates | Field | Value | | --- | --- | | Publication date | 23 Aug 2023 | | Submission deadline | Not specified | | Future notice date | 2 Oct 2023 | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £1,900,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Planned | | Lots status | Planned | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1QE | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting ### Codes - 31710000 - Electronic equipment - 31712330 - Semiconductors ## Release History - 23 Aug 2023 at 00:00 - Planning - OJEU - F1 - Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG486653 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG486653 NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=742450 - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000742450 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000742450. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000742450.json.