--- title: "Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment" ocid: "ocds-r6ebe6-0000749057" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000749057" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000749057.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000749057.json" source: "Public Contracts Scotland" current_stage: "Planning" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2023-11-01" --- # Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Planning OCID: ocds-r6ebe6-0000749057 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000749057) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000749057.json) ## Summary The University of Strathclyde, based in Glasgow, UK, has initiated a tender process for the procurement of Laser Wafer Dicing Equipment. The procurement is in the planning stage and is being led by the University's central purchasing body. The equipment is intended to support the university's expansion into the semiconductor advanced packaging sector, with a focus on power electronic semiconductors. The deadline for future notice is set for December 1, 2023. This tender offers business growth opportunities for companies involved in supplying, delivering, installing, and commissioning advanced manufacturing equipment. Businesses in the goods category catering to the semiconductor industry would be well-suited to compete. The University of Strathclyde is particularly seeking suppliers who can provide equipment for laser wafer dicing and associated ancillaries to enhance its research and development capabilities in power electronic semiconductor manufacturing. ## Notice NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser wafer dicing capability along with any and all associated ancillaries required ### Lot Information Lot 1 NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement process will be procuring equipment for a laser wafer dicing capability along with any and all associated ancillaries required. The University is seeking a supplier to supply, deliver, install, and commission the equipment. ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=NOV491690 | | Notice type | PCS Notice - Website Prior Information Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Not Specified | | Procurement method details | Not specified | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Planning | ## Dates | Field | Value | | --- | --- | | Publication date | 1 Nov 2023 | | Submission deadline | Not specified | | Future notice date | 1 Dec 2023 | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £500,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Planned | | Lots status | Planned | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XQ | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting ### Codes - 31710000 - Electronic equipment - 31712330 - Semiconductors ## Release History - 1 Nov 2023 at 00:00 - Planning - PCS Notice - Website Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=NOV491690 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=NOV491690 Supply, Delivery, Installation & Commissioning of Laser Wafer Dicing Equipment - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser wafer dicing capability along with any and all associated ancillaries required ## Notice URLs - http:// - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000749057 - https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=742450 - https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=749057 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000749057. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000749057.json.