---
title: "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment."
ocid: "ocds-r6ebe6-0000753744"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000753744"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000753744.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000753744.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2024-07-03"
---

# NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-r6ebe6-0000753744

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## Summary

The University of Strathclyde, based in Glasgow, UK, has completed the procurement process for a project titled "NMIS Power Electronics Advanced Packaging Semiconductor Facility." The project falls under the industry category of Education and involved the acquisition of equipment for die bonding, wire bonding, and encapsulation. The University sought suppliers through an open procedure and has awarded the contract to Accelonix. The contract, valued at £1,963,564, was signed on 24th June 2024.

This tender by the University of Strathclyde presents business growth opportunities for suppliers in the goods category, particularly SMEs operating in the semiconductor industry. Businesses with expertise in equipment supply related to die bonding, wire bonding, and encapsulation for power electronic semiconductors are well-suited to compete in this procurement. The project offers a chance for suppliers to contribute to the expansion of manufacturing capabilities in the semiconductor advanced packaging sector.

## Notice

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

### Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing

Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL509066 |
| Notice type | OJEU - F3 - Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | SME |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 3 Jul 2024 |
| Submission deadline | 5 Feb 2024 |
| Future notice date | Not specified |
| Award date | 24 Jun 2024 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £1,900,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £1,963,564 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1QE |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | ACCELONIX |

## CPV Codes

### Divisions

- 31 - Electrical machinery, apparatus, equipment and consumables; lighting

### Codes

- 31710000 - Electronic equipment
- 31712330 - Semiconductors

## Release History

- 3 Jul 2024 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL509066
- 20 Dec 2023 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC495254

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC495254
  NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL509066
  NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

## Notice URLs

- http://
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000753744
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000753744. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000753744.json.