--- title: "Provision of Mechanical Testing - pull, push, shear, and bend\"." ocid: "ocds-r6ebe6-0000760553" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000760553" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000760553.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000760553.json" source: "Public Contracts Scotland" current_stage: "Planning" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2024-03-08" --- # Provision of Mechanical Testing - pull, push, shear, and bend". Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Planning OCID: ocds-r6ebe6-0000760553 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000760553) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000760553.json) ## Summary The University of Strathclyde located in Glasgow, UK, is planning a tender process for the provision of mechanical testing equipment to support its expansion into semiconductor advanced packaging. The planned procurement notice titled "Provision of Mechanical Testing - pull, push, shear, and bend" highlights the University's focus on power electronic semiconductors. The procurement stage is currently in the planning phase, with a future notice date of 1st May 2024. Businesses in the goods category related to power electronics and semiconductor industry would find this opportunity relevant. The University of Strathclyde is seeking a supplier to deliver and install flexible mechanical testing equipment for power electronic semiconductors. This procurement process aims to support the University's research facility in developing and scaling up advanced packaging capabilities for power electronic semiconductors. With a contract value of £170,000 GBP, this opportunity presents a chance for businesses with expertise in power electronic semiconductor designs and testing equipment to compete. The University's emphasis on the mechanical testing capabilities required signifies a need for suppliers specializing in precision engineering and semiconductor testing services. ## Notice NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support mechanical testing equipment that can perform pull, push, shear, and bend tests along with any and all associated ancillaries required. ### Lot Information Lot 1 NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement process will be procuring equipment to support mechanical testing equipment that can perform pull, push, shear, and bend tests along with any and all associated ancillaries required. The University is seeking a supplier to supply, deliver, install, and commission the equipment. ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR500529 | | Notice type | PCS Notice - Website Prior Information Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Not Specified | | Procurement method details | Not specified | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Planning | ## Dates | Field | Value | | --- | --- | | Publication date | 8 Mar 2024 | | Submission deadline | Not specified | | Future notice date | 1 May 2024 | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £170,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Planned | | Lots status | Planned | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XQ | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting ### Codes - 31712330 - Semiconductors ## Release History - 8 Mar 2024 at 00:00 - Planning - PCS Notice - Website Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR500529 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR500529 Provision of Mechanical Testing - pull, push, shear, and bend". - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support mechanical testing equipment that can perform pull, push, shear, and bend tests along with any and all associated ancillaries required. ## Notice URLs - http:// - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000760553 - https://www.publiccontractsscotland.gov.uk - https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=760553 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000760553. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000760553.json.