--- title: "Wafer Dicing Equipment" ocid: "ocds-r6ebe6-0000765290" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000765290" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000765290.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000765290.json" source: "Public Contracts Scotland" current_stage: "Planning" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2024-04-30" --- # Wafer Dicing Equipment Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Planning OCID: ocds-r6ebe6-0000765290 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000765290) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000765290.json) ## Summary The University of Strathclyde is planning a procurement process for Wafer Dicing Equipment. The procurement is part of expanding manufacturing capability into the semiconductor advanced packaging area, focusing on power electronic semiconductors. The equipment needed must be flexible to support various semiconductor designs and packaging requirements. The procurement stage is still in the planning phase, with a future notice date set for June 3, 2024, in Glasgow, UK. The main procurement category is goods, and the total contract value is £70,000. This tender offers opportunities for businesses involved in manufacturing semiconductor equipment and technology. Companies specialising in power electronic semiconductors and semiconductor packaging would be well-suited to compete. The University of Strathclyde aims to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The procurement method is a tender initiated by the University, providing a chance for suppliers to offer solutions for wafer mount equipment in the semiconductor sector. ## Notice NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment. ### Lot Information Lot 1 NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, back grind, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity to acquire wafer mount equipment to allow semiconductor wafers to be mounted to / demounted from carriers to facilitate dicing and back grinding processes (in either order) in a manual / semi-automated fashion. ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR504235 | | Notice type | PCS Notice - Website Prior Information Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Not Specified | | Procurement method details | Not specified | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Planning | ## Dates | Field | Value | | --- | --- | | Publication date | 30 Apr 2024 | | Submission deadline | Not specified | | Future notice date | 3 Jun 2024 | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £70,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Planned | | Lots status | Planned | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XQ | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting ### Codes - 31712330 - Semiconductors ## Release History - 30 Apr 2024 at 00:00 - Planning - PCS Notice - Website Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR504235 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR504235 Wafer Dicing Equipment - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment. ## Notice URLs - http:// - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000765290 - https://www.publiccontractsscotland.gov.uk - https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=765290 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000765290. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000765290.json.