--- title: "NMIS Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipment" ocid: "ocds-r6ebe6-0000767366" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000767366" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000767366.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000767366.json" source: "Public Contracts Scotland" current_stage: "Planning" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2024-05-23" --- # NMIS Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipment Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Planning OCID: ocds-r6ebe6-0000767366 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000767366) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000767366.json) ## Summary The University of Strathclyde, located in Glasgow, UKM82, is planning a tender for the procurement of equipment for the NMIS Power Electronics Advanced Packaging Semiconductor Facility. The focus is on acquiring wafer mount equipment to support the expansion into semiconductor advanced packaging, specifically power electronic semiconductors. The procurement is in the planning stage, with a future notice date of 28th June 2024, with an estimated value of £70,000 in GBP. This tender by the University of Strathclyde presents an opportunity for businesses in the goods category, particularly those involved in manufacturing equipment for semiconductor advanced packaging and power electronic semiconductors. Businesses with expertise in developing flexible equipment for diverse semiconductor designs and packaging requirements would be well-suited to compete for this tender. The procurement process is part of the university's initiative to enhance research and development capabilities in the power electronics sector. ## Notice NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment. ### Lot Information Lot 1 NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, back grind, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity to acquire wafer mount equipment to allow semiconductor wafers to be mounted to / demounted from carriers to facilitate dicing and back grinding processes (in either order) in a manual / semi-automated fashion. ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY505817 | | Notice type | PCS Notice - Website Prior Information Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Not Specified | | Procurement method details | Not specified | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Planning | ## Dates | Field | Value | | --- | --- | | Publication date | 23 May 2024 | | Submission deadline | Not specified | | Future notice date | 28 Jun 2024 | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £70,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Planned | | Lots status | Planned | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XQ | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting ### Codes - 31712330 - Semiconductors ## Release History - 23 May 2024 at 00:00 - Planning - PCS Notice - Website Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY505817 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY505817 NMIS Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipment - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment. ## Notice URLs - http:// - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000767366 - https://www.publiccontractsscotland.gov.uk - https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=765290 - https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=767366 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000767366. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000767366.json.