--- title: "Supply, Delivery and Installation of wafer dicing kit for NMIS" ocid: "ocds-r6ebe6-0000769827" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000769827" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000769827.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000769827.json" source: "Public Contracts Scotland" current_stage: "Award" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2025-01-16" --- # Supply, Delivery and Installation of wafer dicing kit for NMIS Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Award OCID: ocds-r6ebe6-0000769827 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000769827) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000769827.json) ## Summary The University of Strathclyde has completed the procurement process for the "Supply, Delivery and Installation of wafer dicing kit for NMIS." This tender falls under the education industry category and is located in Glasgow, UK (region UKM82). The procurement process followed an open procedure and reached the award stage on 16 January 2025. The contract, valued at £305,414, was signed on 4 December 2024. This procurement supports the expansion of the National Manufacturing Institute Scotland's (NMIS) capabilities into semiconductor advanced packaging for power electronic semiconductors, including establishing a facility equipped with the latest technology in a clean room environment. This tender presents significant opportunities for businesses involved in the semiconductor and power electronics sectors. Particularly, suppliers of advanced manufacturing equipment suited for semiconductor packaging processes are well-suited to compete. The awarded contract to S3 Alliance Ltd, a small to medium-sized enterprise (SME) located in Derry, illustrates the potential for SMEs to secure substantial contracts. Businesses with expertise in manufacturing, packaging, and technology provision for power electronics and those capable of delivering flexible and state-of-the-art equipment stand to benefit from similar future opportunities. The inclusive approach of NMIS, making the facility available to academic and industrial partners across the United Kingdom, further enhances prospects for businesses looking to engage in collaborative and innovative projects. ## Notice The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. ### Lot Information Saw Dicing The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 1 - Saw Dicing Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations. Laser Dicing The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 2 - Laser Dicing Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations. Scribe & Break The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in a ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The University is seeking to establish a contract for wafer dicing equipment and is subsequently tendering the lots outlined below: Lot 3 - Scribe & Break Options: The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations. ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521894 | | Notice type | OJEU - F3 - Contract Award Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure | | Tender suitability | Not specified | | Awardee scale | SME | | All stages | Tender, Award | ## Dates | Field | Value | | --- | --- | | Publication date | 16 Jan 2025 | | Submission deadline | 22 Jul 2024 | | Future notice date | Not specified | | Award date | 4 Dec 2024 | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £1,000,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | £305,414 | ## Status | Field | Value | | --- | --- | | Tender status | Complete | | Lots status | Active, Complete | | Awards status | Not specified | | Contracts status | Active | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XQ | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## Supplier | Field | Value | | --- | --- | | Number of suppliers | 1 | | Supplier names | S3 ALLIANCE | ## CPV Codes ### Divisions - 31 - Electrical machinery, apparatus, equipment and consumables; lighting ### Codes - 31712330 - Semiconductors ## Release History - 16 Jan 2025 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521894 - 19 Jun 2024 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUN507815 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUN507815 Supply, Delivery and Installation of wafer dicing kit for NMIS - The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521894 Supply, Delivery and Installation of wafer dicing kit for NMIS - The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000769827 - https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ - https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html - https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/toolkit/dashboard/dashboard.do?_ncp=1718717323289.17229-1 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000769827. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000769827.json.