---
title: "Supply, Delivery and Installation of a wafer mount for NMIS"
ocid: "ocds-r6ebe6-0000771440"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000771440"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000771440.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000771440.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2025-01-15"
---

# Supply, Delivery and Installation of a wafer mount for NMIS

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-r6ebe6-0000771440

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## Summary

The University of Strathclyde, based in Glasgow, has completed the procurement process for the supply, delivery, and installation of a wafer mount for the National Manufacturing Institute Scotland (NMIS). This open procurement procedure involved the contract being awarded to Inseto (UK) Limited. With a focus on the electronics and semiconductor industry, the procurement aims to support advanced power electronics semiconductor packaging within an ISO-7 clean room environment. Key dates include the tender issue date on 3rd July 2024, bid opening on 24th July 2024, and the contract being signed on 4th November 2024.

This tender presents significant growth opportunities for businesses specialising in high-tech manufacturing equipment, particularly those experienced in semiconductor packaging solutions. Companies with expertise in providing advanced technological solutions that meet stringent quality standards, such as those required for clean room environments, would be well-suited to compete for similar contracts. Being involved in such a high-profile, publicly funded project could enhance the market reputation and open up further opportunities with other academic and industrial partners across the UK and beyond.

## Notice

This Procurement shall cover the supply, delivery and installation of specific equipment that is suitable for the detailed inspection of a range of components used in advanced power electronics compound semi-conductor packaging, both at a piece part level and an assembly level. A semi-auto wafer mounter/de-mount is required for mounting wafers (up to 12") onto taped frames (carriers) for use in dicing and die attach machines

### Lot Information

Lot 1

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements This is in support of a publicly funded project that will see the creation of an advanced, scaled up packaging facility for power electronics within the National Manufacturing Institute Scotland. The overall scale up manufacturing facility is to be housed at an NMIS site; this semiconductor advanced packaging area will be housed in an ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres This Procurement shall cover the supply, delivery and installation of specific equipment that is suitable for the detailed inspection of a range of components used in advanced power electronics compound semi-conductor packaging, both at a piece part level and an assembly level. A semi-auto wafer mounter/de-mount is required for mounting wafers (up to 12") onto taped frames (carriers) for use in dicing and die attach machines

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521777 |
| Notice type | PCS Notice - Website Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | SME |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 15 Jan 2025 |
| Submission deadline | 24 Jul 2024 |
| Future notice date | Not specified |
| Award date | 4 Nov 2024 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £66,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XQ |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | INSETO (UK |

## CPV Codes

### Divisions

- 31 - Electrical machinery, apparatus, equipment and consumables; lighting

### Codes

- 31712330 - Semiconductors

## Release History

- 15 Jan 2025 at 00:00 - Award - PCS Notice - Website Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521777
- 3 Jul 2024 at 00:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL509058

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL509058
  Supply, Delivery and Installation of a wafer mount for NMIS - This Procurement shall cover the supply, delivery and installation of specific equipment that is suitable for the detailed inspection of a range of components used in advanced power electronics compound semi-conductor packaging, both at a piece part level and an assembly level. A semi-auto wafer mounter/de-mount is required for mounting wafers (up to 12") onto taped frames (carriers) for use in dicing and die attach machines
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JAN521777
  Supply, Delivery and Installation of a wafer mount for NMIS - This Procurement shall cover the supply, delivery and installation of specific equipment that is suitable for the detailed inspection of a range of components used in advanced power electronics compound semi-conductor packaging, both at a piece part level and an assembly level. A semi-auto wafer mounter/de-mount is required for mounting wafers (up to 12") onto taped frames (carriers) for use in dicing and die attach machines

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000771440
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000771440. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000771440.json.
