---
title: "Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)"
ocid: "ocds-r6ebe6-0000795012"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000795012"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000795012.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000795012.json"
source: "Public Contracts Scotland"
current_stage: "Planning"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2025-04-01"
---

# Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Planning  
OCID: ocds-r6ebe6-0000795012

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## Summary

The University of Strathclyde, located in Glasgow, is in the planning stage for a procurement process focused on expanding the National Manufacturing Institute of Scotland’s (NMIS) manufacturing capabilities in the semiconductor advanced packaging area. The tender, titled "Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)," falls under the Education industry category and covers procurement of equipment for wafer laminating, back grinding, polishing, and cleaning with an estimated value range between GBP1.2m to GBP2m. The procurement activity is scheduled to proceed with the preliminary market consultation ending at 12 noon on 10th April 2025, and the future notice date set for 22nd April 2025.

This tender offers significant opportunities for businesses involved in the manufacturing of semiconductor equipment and services, specifically those capable of supplying turnkey solutions for wafer processing. Companies with expertise in semiconductor technologies, advanced packaging, and cleanroom solutions are well-suited to compete for this contract. This opportunity can enable businesses to contribute to NMIS's goal of creating a high-tech research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors, fostering growth and innovation in this sector.

## Notice

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m

### Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, thin, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus will be procuring equipment as a turnkey to support, wafer back grinding, wafer polishing, and wafer cleaning. The capability will allow rough and fine dry polishing as well as rough and fine Chemical Mechanical Polishing. This will also include the requirement for ancillary equipment to provide services to these processes, including but not limited to water. The cleanroom facility has a limited water supply and waste water capability and so closed loop systems are preferred wherever possible. The necessary services of Electrical power, CDA and Nitrogen will be available, and plant to provide these services is not in scope for this procurement activity. Wherever necessary, suitable sources of vacuum should be included.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR527305 |
| Notice type | PCS Notice - Website Prior Information Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Not Specified |
| Procurement method details | Not specified |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Planning |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 1 Apr 2025 |
| Submission deadline | Not specified |
| Future notice date | 22 Apr 2025 |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £1,200,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Planned |
| Lots status | Planned |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | Not specified |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 1 Apr 2025 at 00:00 - Planning - PCS Notice - Website Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR527305

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=APR527305
  Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS) - NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m

## Notice URLs

- http://
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000795012
- https://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=795012

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000795012. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000795012.json.