---
title: "Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT"
ocid: "ocds-r6ebe6-0000799129"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000799129"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000799129.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000799129.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2025-08-13"
---

# Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-r6ebe6-0000799129

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## Summary

The University of Strathclyde, located in Glasgow, UK, recently completed the procurement process for the "Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT". This contract is part of a publicly funded project aimed at establishing an advanced power electronics packaging facility within the National Manufacturing Institute Scotland. The awarded contract, valued at £1,005,000, was executed through an open procedure under the goods procurement category, with Disco Hi-Tech UK Ltd confirmed as the supplier. Significant dates include the signing of the contract on 30th July 2025. The tendering period ended on 20th June 2025. This project targets the Education industry and is designed to support semiconductor research and development across the UK.

This tender provides considerable opportunities for businesses involved in the Power Electronics sector, particularly those specialising in semiconductor manufacturing technologies. Companies that offer innovative solutions in wafer thinning, polishing, and cleaning systems are well-suited to engage with such contracts. The initiative not only provides an avenue for supplying high-efficiency grinding and polishing equipment but also encourages collaboration with academic and industrial partners throughout the UK. The facilities will be available to numerous research and manufacturing projects, enhancing capacity and innovation in the industry. Competing in this tender aligns with the strategic growth initiatives of businesses aiming to expand their reach in high-tech and research-driven engineering sectors.

## Notice

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers

### Lot Information

Lot 1

The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG536956 |
| Notice type | OJEU - F3 - Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 13 Aug 2025 |
| Submission deadline | 20 Jun 2025 |
| Future notice date | Not specified |
| Award date | 30 Jul 2025 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £2,000,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £1,005,000 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | DISCO HI-TECH |

## CPV Codes

### Divisions

- 31 - Electrical machinery, apparatus, equipment and consumables; lighting

### Codes

- 31710000 - Electronic equipment
- 31712330 - Semiconductors

## Release History

- 13 Aug 2025 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG536956
- 20 May 2025 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY530711

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY530711
  Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT - The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG536956
  Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT - The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000799129
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000799129. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000799129.json.