--- title: "Supply, Delivery and Installation Sinter Bonding Capability" ocid: "ocds-r6ebe6-0000813517" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000813517" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000813517.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000813517.json" source: "Public Contracts Scotland" current_stage: "Planning" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2025-10-20" --- # Supply, Delivery and Installation Sinter Bonding Capability Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Planning OCID: ocds-r6ebe6-0000813517 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000813517) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000813517.json) ## Summary See notice for full details. ## Notice National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages. ### Lot Information Lot 1 NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production. In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation. ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=OCT541767 | | Notice type | OJEU - F1 - Prior Information Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Not Specified | | Procurement method details | Not specified | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Planning | ## Dates | Field | Value | | --- | --- | | Publication date | 20 Oct 2025 | | Submission deadline | Not specified | | Future notice date | 5 Nov 2025 | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | Not specified | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Planned | | Lots status | Planned | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XU | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 20 Oct 2025 at 00:00 - Planning - OJEU - F1 - Prior Information Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=OCT541767 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=OCT541767 Supply, Delivery and Installation Sinter Bonding Capability - National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/Search/Search_Switch.aspx?ID=813517 - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000813517 ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000813517. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000813517.json.