---
title: "Supply, Delivery and Installation of Sinter Bonding Capability"
ocid: "ocds-r6ebe6-0000818603"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000818603"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000818603.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000818603.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2026-05-13"
---

# Supply, Delivery and Installation of Sinter Bonding Capability

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Award  
OCID: ocds-r6ebe6-0000818603

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## Summary

The University of Strathclyde, based in Glasgow, has successfully awarded a contract for the "Supply, Delivery and Installation of Sinter Bonding Capability" under an open procurement procedure. This purchase is part of the expansion of the National Manufacturing Institute Scotland's (NMIS) capabilities in semiconductor advanced packaging, specifically targeting power electronic semiconductors. The contract was awarded to Inseto UK Limited on 23 March 2026, with a contract value of £819,990. This procurement process covered goods within the education sector and is classified under CPV code 38000000. The process moved from tendering, initiated in December 2025 with submissions closing by 26 January 2026, to a completed award stage.

This tender offers business growth opportunities for firms involved in supply and installation of semiconductors and related technologies, especially those specialised in innovative and flexible equipment design that can support a range of semiconductor packaging requirements. Companies that have a background in R&D and medium volume production in the semiconductor industry would find this contract appealing. The procurement emphasised versatility, requiring features such as automated handling and capabilities to operate under inert atmospheres, providing an ideal platform for businesses to showcase their technical expertise and innovative solutions in semiconductor processing. SMEs particularly benefited, as indicated by the successful bid from Inseto UK Limited, aligning with the University of Strathclyde's interest in supporting smaller, agile suppliers in the market.

## Notice

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

### Lot Information

Lot 1

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production. In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY555762 |
| Notice type | OJEU - F3 - Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | SME |
| All stages | Tender, Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 13 May 2026 |
| Submission deadline | 26 Jan 2026 |
| Future notice date | Not specified |
| Award date | 23 Mar 2026 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | £900,000 |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £819,990 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | INSETO |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 13 May 2026 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY555762
- 17 Dec 2025 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC545904

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC545904
  Supply, Delivery and Installation of Sinter Bonding Capability - National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAY555762
  Supply, Delivery and Installation of Sinter Bonding Capability - National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000818603
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000818603. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000818603.json.