---
title: "EBeam Lithographer"
ocid: "ocds-r6ebe6-0000825231"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000825231"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000825231.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000825231.json"
source: "Public Contracts Scotland"
current_stage: "Award"
buyer: "UNIVERSITY OF EDINBURGH"
published: "2026-03-02"
---

# EBeam Lithographer

Buyer: UNIVERSITY OF EDINBURGH  
Current stage: Award  
OCID: ocds-r6ebe6-0000825231

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## Summary

The University of Edinburgh has completed a procurement process for an EBeam Lithographer in the industry category of education. The contracting authority sought to acquire a sophisticated electron beam lithography system, meeting strict technical specifications, including ultra-fine line lithography and high throughput capabilities. As this procurement involved a highly specialised piece of equipment, the process utilises a limited procurement method due to the absence of competition for technical reasons, resulting in an award to JEOL (UK) Ltd. The contract, valued at £2,398,869 GBP, was signed on 19 February 2026 for delivery to Edinburgh, Scotland.

This tender exemplifies opportunities for specialised suppliers in the technical field of electron beam systems, offering growth possibilities for businesses capable of meeting exacting technical standards. While this specific contract was awarded without prior competition, businesses with expertise in the advancement and refinement of scientific equipment may find similar procurement processes advantageous to pursue. Larger enterprises with advanced technological offerings and capacity for customisation and technical adherence will be well-suited to compete in similar tenders in the education sector.

## Notice

The University has a requirement for an Electron Beam lithography system which has an acceleration voltage of at least 200 kV. It must be capable of the following: a) Ultra-fine line lithography: 3 nm linewidth, using commercially available resists. This can be obtained by its single-nm digit beam diameter. b) Ultra-high position accuracy: This can be obtained by a laser interferometer with A (sub-1 nm) reading resolution, enabling a stitching accuracy of +-8 nm and overlay accuracy of +-8 nm. c) Uniform fine pattern writing over entire field: Uniform nm-scale lines can be drawn from edge to edge across a large field (>=2000mm) without the need for stitching. This guarantees better accuracy, eliminates the need for stage movement, and enhances writing speed and throughput. d) High throughput lithography: This will be enabled by a 125 MHz (or higher) high-speed deflection system coupled with a new electron beam column design. e) Wafer scale (& multi wafer) processing: Single cassette auto-loader supporting 8-inch wafers with a multi-cassette automatic sample loading system. Fast loading and pumping time. f) Flexibility in sample holders: Offer the ability to simultaneously handle a variety of wafer sizes by incorporating distinct holders for processing full wafers (2-8 inches) and/or small. g) Software: SEM Imaging Software, Alignment Software and CAD designing Software, which allows using and/or converting into industry standard GDSII and DXF file formats. It is believed the JEOL JBX-8100FS G3 Electron Beam Lithography System is the sole machine which complies with these requirements. Therefore, we deem competition is absent for technical reasons.

### Lot Information

Lot 1

The University has a requirement for an Electron Beam lithography system which has an acceleration voltage of at least 200 kV. It must be capable of the following: a) Ultra-fine line lithography: 3 nm linewidth, using commercially available resists. This can be obtained by its single-nm digit beam diameter. b) Ultra-high position accuracy: This can be obtained by a laser interferometer with A (sub-1 nm) reading resolution, enabling a stitching accuracy of +-8 nm and overlay accuracy of +-8 nm. c) Uniform fine pattern writing over entire field: Uniform nm-scale lines can be drawn from edge to edge across a large field (>=2000mm) without the need for stitching. This guarantees better accuracy, eliminates the need for stage movement, and enhances writing speed and throughput. d) High throughput lithography: This will be enabled by a 125 MHz (or higher) high-speed deflection system coupled with a new electron beam column design. e) Wafer scale (& multi wafer) processing: Single cassette auto-loader supporting 8-inch wafers with a multi-cassette automatic sample loading system. Fast loading and pumping time. f) Flexibility in sample holders: Offer the ability to simultaneously handle a variety of wafer sizes by incorporating distinct holders for processing full wafers (2-8 inches) and/or small. g) Software: SEM Imaging Software, Alignment Software and CAD designing Software, which allows using and/or converting into industry standard GDSII and DXF file formats. It is believed the JEOL JBX-8100FS G3 Electron Beam Lithography System is the sole machine which complies with these requirements. Therefore, we deem competition is absent for technical reasons.

Options: For transparency, extensions to service arrangements, and spare parts, may be purchased from the awarded supplier.

### Procurement Information

The University has a requirement for an Electron Beam lithography system which has an acceleration voltage of at least 200 kV. It must be capable of the following: a) Ultra-fine line lithography: 3 nm linewidth, using commercially available resists. This can be obtained by its single-nm digit beam diameter. b) Ultra-high position accuracy: This can be obtained by a laser interferometer with A (sub-1 nm) reading resolution, enabling a stitching accuracy of +-8 nm and overlay accuracy of +-8 nm. c) Uniform fine pattern writing over entire field: Uniform nm-scale lines can be drawn from edge to edge across a large field (>=2000mm) without the need for stitching. This guarantees better accuracy, eliminates the need for stage movement, and enhances writing speed and throughput. d) High throughput lithography: This will be enabled by a 125 MHz (or higher) high-speed deflection system coupled with a new electron beam column design. e) Wafer scale (& multi wafer) processing: Single cassette auto-loader supporting 8-inch wafers with a multi-cassette automatic sample loading system. Fast loading and pumping time. f) Flexibility in sample holders: Offer the ability to simultaneously handle a variety of wafer sizes by incorporating distinct holders for processing full wafers (2-8 inches) and/or small. g) Software: SEM Imaging Software, Alignment Software and CAD designing Software, which allows using and/or converting into industry standard GDSII and DXF file formats. It is believed the JEOL JBX-8100FS G3 Electron Beam Lithography System is the sole machine which complies with these requirements. Therefore, we deem competition is absent for technical reasons.

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR550684 |
| Notice type | OJEU - F3 - Contract Award Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Limited |
| Procurement method details | Award procedure without prior publication of a call for competition |
| Tender suitability | Not specified |
| Awardee scale | Large |
| All stages | Award |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 2 Mar 2026 |
| Submission deadline | Not specified |
| Future notice date | Not specified |
| Award date | 19 Feb 2026 |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | £2,398,869 |

## Status

| Field | Value |
| --- | --- |
| Tender status | Complete |
| Lots status | Complete |
| Awards status | Not specified |
| Contracts status | Active |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF EDINBURGH |
| Locality | EDINBURGH |
| Post town | Edinburgh |
| Postcode | EH1 1HT |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM1 East Central Scotland |
| ITL 3 | TLM13 City of Edinburgh |
| Local authority | City of Edinburgh |
| Electoral ward | City Centre |
| Westminster constituency | Edinburgh East and Musselburgh |
| Delivery location | TLM75 City of Edinburgh |

## Supplier

| Field | Value |
| --- | --- |
| Number of suppliers | 1 |
| Supplier names | JEOL (UK |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 2 Mar 2026 at 00:00 - Award - OJEU - F3 - Contract Award Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR550684

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=MAR550684
  EBeam Lithographer - The University has a requirement for an Electron Beam lithography system which has an acceleration voltage of at least 200 kV. It must be capable of the following: a) Ultra-fine line lithography: 3 nm linewidth, using commercially available resists. This can be obtained by its single-nm digit beam diameter. b) Ultra-high position accuracy: This can be obtained by a laser interferometer with A (sub-1 nm) reading resolution, enabling a stitching accuracy of +-8 nm and overlay accuracy of +-8 nm. c) Uniform fine pattern writing over entire field: Uniform nm-scale lines can be drawn from edge to edge across a large field (>=2000mm) without the need for stitching. This guarantees better accuracy, eliminates the need for stage movement, and enhances writing speed and throughput. d) High throughput lithography: This will be enabled by a 125 MHz (or higher) high-speed deflection system coupled with a new electron beam column design. e) Wafer scale (& multi wafer) processing: Single cassette auto-loader supporting 8-inch wafers with a multi-cassette automatic sample loading system. Fast loading and pumping time. f) Flexibility in sample holders: Offer the ability to simultaneously handle a variety of wafer sizes by incorporating distinct holders for processing full wafers (2-8 inches) and/or small. g) Software: SEM Imaging Software, Alignment Software and CAD designing Software, which allows using and/or converting into industry standard GDSII and DXF file formats. It is believed the JEOL JBX-8100FS G3 Electron Beam Lithography System is the sole machine which complies with these requirements. Therefore, we deem competition is absent for technical reasons.

## Notice URLs

- http://
- http://www.ed.ac.uk
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000825231

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000825231. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000825231.json.