--- title: "Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment" ocid: "ocds-r6ebe6-0000835634" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000835634" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000835634.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000835634.json" source: "Public Contracts Scotland" current_stage: "Tender" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2026-07-20" --- # Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Tender OCID: ocds-r6ebe6-0000835634 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000835634) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000835634.json) ## Summary The University of Strathclyde is currently engaging in a procurement process for the "Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment," focusing on the Education industry category. Located in Glasgow, this tender is part of an active stage aiming to close a market gap in the UK's semiconductor packaging capabilities. The procurement is managed openly, with potential vendors invited to submit their bids electronically by 19th August 2026. The tender's estimated value is £1,000,000 and encompasses essential equipment to help meet industry standards at the National Centre for Advanced Semiconductor Packaging. This tender presents significant business growth opportunities, particularly for firms specialising in the manufacture and supply of reliability testing equipment such as climatic and thermal shock chambers. Businesses with experience in delivering high-quality equipment to educational institutions or within the technology sector should find this opportunity well-suited to their capabilities. Participants must demonstrate financial stability with a minimum yearly turnover and provide evidence of relevant past experience through examples, making it ideal for established entities looking to expand their presence within the UK market. ## Notice Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber. ### Lot Information Lot 1 This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber. Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option. Renewal: 12 months (if required maintenance and warranty) ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL560497 | | Notice type | OJEU - F2 - Contract Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Tender | ## Dates | Field | Value | | --- | --- | | Publication date | 20 Jul 2026 | | Submission deadline | 19 Aug 2026 | | Future notice date | Not specified | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £1,000,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Active | | Lots status | Active | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XU | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 20 Jul 2026 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL560497 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL560497 Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000835634 - https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ - https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000835634. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000835634.json.