---
title: "Supply, Delivery and Installation of Solder Jetting Equipment"
ocid: "ocds-r6ebe6-0000838017"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838017"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838017.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838017.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2026-07-30"
---

# Supply, Delivery and Installation of Solder Jetting Equipment

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Tender  
OCID: ocds-r6ebe6-0000838017

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## Summary

The University of Strathclyde, located in Glasgow, is inviting tenders for the supply, delivery, and installation of Solder Jetting Equipment. This contract falls under the industry category of education and is intended to support the development of the National Centre for Advanced Semiconductor Packaging (NCASP). The procurement process is in the tender stage, with an open procedure method being utilised. Interested parties need to submit their bids electronically by 31st August 2026, prior to the award period starting the same day. The contract will be delivered within the Glasgow region, specifically targeting goods related to photonic and semiconductor device packaging.

This tender represents a significant opportunity for businesses specialising in advanced semiconductor and photonic device processing. Companies with experience in semiconductor packaging and the capacity to provide integrated solutions could find growth potential through involvement in this initiative. Solder Jetting technology suppliers and those engaged in high-volume manufacturing and integration processes are particularly well-placed to benefit. Meeting the turnover and insurance criteria, along with demonstrated experience from past projects, will be crucial for businesses aiming to participate successfully in this tender.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561200 |
| Notice type | OJEU - F2 - Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 30 Jul 2026 |
| Submission deadline | 31 Aug 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 30 Jul 2026 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561200

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561200
  Supply, Delivery and Installation of Solder Jetting Equipment - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000838017
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838017. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000838017.json.