---
title: "Supply, Delivery and Installation of Hermetic Sealing Kit"
ocid: "ocds-r6ebe6-0000838736"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838736"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838736.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838736.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2026-07-30"
---

# Supply, Delivery and Installation of Hermetic Sealing Kit

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Tender  
OCID: ocds-r6ebe6-0000838736

[View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838736)  
[Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000838736.json)

## Summary

The University of Strathclyde, a central purchasing body, has initiated a tender process for the supply, delivery, and installation of a Hermetic Sealing Kit. This procurement falls under the Education industry category and is situated in Glasgow, UK, specifically within region UKM82. The tender, identified by code UOS-43648-2026, is currently active, and the procurement process is in the tender stage with an open procedure. Interested suppliers can submit electronic bids until the tender period closes on 1st September 2026 at 12:00 PM. This initiative is part of the broader effort to establish a national advanced semiconductor packaging capability, addressing current market deficiencies and fostering an industry-led scale-up facility within the UK.

This tender presents a significant opportunity for businesses involved in photonic and advanced semiconductor packaging technologies. Companies with expertise in seam sealing and projection welding processes will be well-suited to compete, particularly if they have a history of high-volume packaging in similar applications. With criteria balanced equally between quality and price, firms that can deliver robust solutions with competitive pricing stand a chance to grow their business and establish long-term relations with the University. Additionally, the emphasis on domestic unit design and manufacture provides a unique position for UK-based enterprises to anchor their value locally, potentially leading to further business growth opportunities and collaborations.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561290 |
| Notice type | OJEU - F2 - Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 30 Jul 2026 |
| Submission deadline | 1 Sep 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 30 Jul 2026 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561290

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561290
  Supply, Delivery and Installation of Hermetic Sealing Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000838736
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838736. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000838736.json.