--- title: "Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter" ocid: "ocds-r6ebe6-0000838765" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838765" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838765.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838765.json" source: "Public Contracts Scotland" current_stage: "Tender" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2026-07-31" --- # Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Tender OCID: ocds-r6ebe6-0000838765 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838765) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000838765.json) ## Summary The University of Strathclyde, a leading educational institution in Glasgow, is actively seeking tenders for the supply, delivery, installation, and commissioning of a die inspection sorter to enhance photonics packaging applications. This procurement falls under the education industry category and targets advancements in semiconductor packaging capabilities within the UK. The procurement stage is currently tendering, with the tender period ending on 1st September 2026 at noon. This open procedure will be conducted electronically, and submissions in English are required. The contract value is estimated at £1,160,000 with payment and ordering being managed electronically. The procurement aligns with initiatives of the National Centre for Advanced Semiconductor Packaging (NCASP) to bolster domestic technology scale-up facilities. This tender presents significant opportunities for businesses involved in semiconductor technologies, particularly those specialising in automated inspection systems and photonic applications. Companies with substantial turnover, robust insurance cover, and a proven track record are well-positioned to compete successfully. By participating, businesses can contribute to a strategic national effort, potentially leading to further opportunities in the evolving landscape of advanced manufacturing technologies in the UK. Engaging in this procurement could enhance a company's market presence, establish long-term partnerships, and catalyse innovation aligned with national industry goals. ## Notice Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications. ### Lot Information Lot 1 Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications. Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option. Renewal: 12 months (if required maintenance and warranty) ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408 | | Notice type | OJEU - F2 - Contract Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Tender | ## Dates | Field | Value | | --- | --- | | Publication date | 31 Jul 2026 | | Submission deadline | 1 Sep 2026 | | Future notice date | Not specified | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | £1,160,000 | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Active | | Lots status | Active | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XU | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 31 Jul 2026 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561408 Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000838765 - https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ - https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838765. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000838765.json.