--- title: "Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester" ocid: "ocds-r6ebe6-0000838770" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838770" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838770.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000838770.json" source: "Public Contracts Scotland" current_stage: "Tender" buyer: "UNIVERSITY OF STRATHCLYDE" published: "2026-08-03" --- # Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester Buyer: UNIVERSITY OF STRATHCLYDE Current stage: Tender OCID: ocds-r6ebe6-0000838770 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838770) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000838770.json) ## Summary The University of Strathclyde, located in Glasgow, has issued a tender for the supply, delivery, and installation of an Automated Laser Chip Burn-in Tester as part of their procurement process. This tender falls under the goods category in the education industry and is crucial for the development of the National Centre for Advanced Semiconductor Packaging. The procurement process is in the tender stage and follows an open procurement method, allowing electronic submissions until the deadline on 7th September 2026. This initiative is designed to enhance the UK's capability in semiconductor packaging, thereby mitigating risks associated with outsourcing abroad. This tender presents substantial growth opportunities for businesses specializing in semiconductor technology, especially those with experience in delivering and installing high-tech equipment. Companies that can demonstrate a track record of successful implementations and meet the financial and insurance requirements stipulated by the University of Strathclyde are well-suited to compete. By participating in this procurement, businesses can leverage the chance to collaborate with a prestigious educational institution and contribute to pivotal technological advancements in the UK, potentially securing a long-term commercial relationship. ## Notice Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing. ### Lot Information Lot 1 Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing. Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option. Renewal: 12 months (if required maintenance and warranty) ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561507 | | Notice type | OJEU - F2 - Contract Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Tender | ## Dates | Field | Value | | --- | --- | | Publication date | 3 Aug 2026 | | Submission deadline | 7 Sep 2026 | | Future notice date | Not specified | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | Not specified | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Active | | Lots status | Active | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | UNIVERSITY OF STRATHCLYDE | | Locality | GLASGOW | | Post town | Glasgow | | Postcode | G1 1XU | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 3 Aug 2026 at 00:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561507 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561507 Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automated laser chip tester capable of performing burn-in testing. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000838770 - https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ - https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000838770. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000838770.json.