---
title: "Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit"
ocid: "ocds-r6ebe6-0000839011"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839011"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839011.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839011.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2026-07-31"
---

# Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Tender  
OCID: ocds-r6ebe6-0000839011

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## Summary

The University of Strathclyde, located in Glasgow, is inviting tenders for the supply, delivery, and installation of a backgrind tape laminator and de-taping kit. This procurement falls under the industry category of education and aims to support the National Centre for Advanced Semiconductor Packaging in creating a domestic, integrated facility for high-volume packaging, test, and metrology. The tender is currently at the "Tender" stage with the procurement method being open procedure. Key dates to note include the tender end date on 17th August 2026 and the award period which also commences on the same day. Deliveries are to be made within the region UKM82, ensuring a cohesive supply chain for the semiconductor industry.

This tender presents significant opportunities for businesses specialising in semiconductor equipment manufacturing, particularly those with previous experience in delivering complex technical solutions. The requirement for a history of high turnover ensures that only financially stable organisations are considered, mitigating financial risks. The contract duration of 720 days, with a possibility of renewal for an additional 12 months, further provides long-term business growth prospects for suppliers. Interested suppliers are expected to demonstrate relevant past experiences in similar supplies and maintain specific insurance levels, which align with the University of Strathclyde's standard terms. This tender process encourages competition and is conducted electronically via PCS-Tender, facilitating straightforward submissions for qualifying businesses.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392 |
| Notice type | PCS Notice - Website Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 31 Jul 2026 |
| Submission deadline | 17 Aug 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 31 Jul 2026 at 00:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=JUL561392
  Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839011
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839011. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839011.json.