---
title: "Supply, Delivery and Installation of Leak Testing Kit"
ocid: "ocds-r6ebe6-0000839068"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839068"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839068.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839068.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "UNIVERSITY OF STRATHCLYDE"
published: "2026-08-04"
---

# Supply, Delivery and Installation of Leak Testing Kit

Buyer: UNIVERSITY OF STRATHCLYDE  
Current stage: Tender  
OCID: ocds-r6ebe6-0000839068

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## Summary

The procurement process is being conducted by the University of Strathclyde for the supply, delivery, and installation of a Leak Testing Kit. This project, titled "Supply, Delivery and Installation of Leak Testing Kit," falls under the "Education" industry category and is located in Glasgow, specifically within the UKM82 region. It is currently in the "Tender" stage, with a tender period ending on 18th August 2026. Interested suppliers must submit their bids electronically. The procurement is an open procedure and aims to establish a sovereign, advanced semiconductor packaging capability in the UK, addressing a critical market failure in photonics and power electronics.

This tender presents numerous opportunities for businesses specializing in semiconductor technologies and equipment supplies, particularly those with experience in photonic and advanced semiconductor packaging solutions. Companies with an average yearly turnover of at least £304,000 over the past three years, and capable of meeting specific insurance and experience criteria, are well-positioned to compete. The requirement for electronic invoicing and payment underscores the need for modern, technologically adept businesses. This contract, set to enhance domestic manufacturing capabilities, could provide a significant growth avenue for businesses involved in high-tech manufacturing and supply chains related to photonics and semiconductor industries.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520 |
| Notice type | PCS Notice - Website Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 4 Aug 2026 |
| Submission deadline | 18 Aug 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | UNIVERSITY OF STRATHCLYDE |
| Locality | GLASGOW |
| Post town | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 4 Aug 2026 at 00:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561520
  Supply, Delivery and Installation of Leak Testing Kit - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description A Leak Testing capability is required for hermetic packages used in photonic and advanced semiconductor packaging.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839068
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839068. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839068.json.