---
title: "Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System"
ocid: "ocds-r6ebe6-0000839268"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839268"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839268.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839268.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "University of Strathclyde"
published: "2026-08-06"
---

# Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

Buyer: University of Strathclyde  
Current stage: Tender  
OCID: ocds-r6ebe6-0000839268

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## Summary

The University of Strathclyde is buying an inductively coupled plasma chemical vapour deposition system, including its supply, delivery and installation. The equipment will support the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to help UK photonics and power-electronics innovators move from device design to domestic, high-volume semiconductor packaging, testing and metrology. This is a goods procurement, with the equipment delivered to Glasgow. The requirement covers one package of equipment and includes the potential for additional deliveries, such as partial replacement of supplies or installations or extensions to existing supplies and installations. The contract also includes maintenance and warranty arrangements, with community benefits forming part of the requirement. Suppliers of specialist semiconductor, thin-film deposition or related advanced manufacturing equipment should assess the technical specification and installation requirements.

The procurement has reached tender: the University invited offers through an open procedure, with electronic submission. Bids were due by 9 September 2026 at 12:00 UTC, with public bid opening at the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries during the contract. There is one lot. Offers are evaluated on quality and price, weighted 60% and 40% respectively. Bids must be submitted in English and remain valid for 180 days after the submission deadline. Electronic ordering and electronic payment will be used, and electronic invoicing is allowed. The process is covered by the Government Procurement Agreement.

This opportunity suits manufacturers, specialist distributors and systems integrators with demonstrable experience supplying and installing inductively coupled plasma chemical vapour deposition equipment or comparable semiconductor processing systems. Bidders must provide three examples showing relevant experience in delivering the required equipment, so established delivery and installation capability is important. The buyer requires an average annual turnover of at least £1.2 million over the last three years, supporting suppliers with an established financial and supply-chain base. Successful suppliers must maintain, or be able to obtain before contract commencement, employers’ liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. Businesses able to provide ongoing maintenance and warranty support, replacement installations and community benefits should be well placed to compete.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561730 |
| Notice type | OJEU - F2 - Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 6 Aug 2026 |
| Submission deadline | 9 Sep 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | University of Strathclyde |
| Locality | GLASGOW |
| Postcode area | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 6 Aug 2026 at 01:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561730

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561730
  Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839268
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839268. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839268.json.