{ "tag": [ "compiled" ], "id": "ocds-r6ebe6-0000839270-2026-08-05T00:00:00Z", "date": "2026-08-05T00:00:00Z", "ocid": "ocds-r6ebe6-0000839270", "initiationType": "tender", "parties": [ { "id": "org-1", "name": "University of Strathclyde", "identifier": { "legalName": "University of Strathclyde" }, "address": { "streetAddress": "Learning & Teaching Building, 49 Richmond Street", "locality": "Glasgow", "region": "UKM82", "postalCode": "G1 1XU" }, "contactPoint": { "name": "Anna Sanina", "email": "anna.sanina@strath.ac.uk", "url": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html" }, "roles": [ "buyer", "centralPurchasingBody" ], "details": { "classifications": [ { "id": "Body governed by public law", "scheme": "TED_CA_TYPE" }, { "id": "09", "description": "Education", "scheme": "COFOG" } ], "url": "http://www.strath.ac.uk/" } }, { "id": "org-2", "name": "Glasgow Sheriff Court", "identifier": { "legalName": "Glasgow Sheriff Court" }, "address": { "streetAddress": "1 Carlton Place", "locality": "Glasgow", "postalCode": "G5 9TW" }, "contactPoint": { "url": "http://" }, "roles": [ "reviewBody" ] } ], "buyer": { "name": "University of Strathclyde", "id": "org-1" }, "tender": { "id": "UOS-43647-2025", "title": "Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector", "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.", "status": "active", "items": [ { "id": "1", "deliveryAddresses": [ { "region": "UKM82" } ], "relatedLot": "1" } ], "procurementMethod": "open", "procurementMethodDetails": "Open procedure", "mainProcurementCategory": "goods", "submissionMethod": [ "electronicSubmission" ], "submissionMethodDetails": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html", "tenderPeriod": { "endDate": "2026-08-25T12:00:00Z" }, "awardPeriod": { "startDate": "2026-08-25T12:00:00Z" }, "documents": [ { "id": "AUG561705", "documentType": "contractNotice", "title": "Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector", "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.", "url": "https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561705", "format": "text/html" } ], "lots": [ { "id": "1", "description": "Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.", "status": "active", "options": { "description": "The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option." }, "hasOptions": true, "submissionTerms": { "variantPolicy": "notAllowed" }, "contractPeriod": { "durationInDays": 720 }, "hasRenewal": true, "renewal": { "description": "12 months (if required maintenance and warranty)" } } ], "bidOpening": { "date": "2026-08-25T12:00:00Z" }, "contractTerms": { "hasElectronicPayment": true, "hasElectronicOrdering": true, "electronicInvoicingPolicy": "allowed" }, "coveredBy": [ "GPA" ], "selectionCriteria": { "criteria": [ { "type": "economic", "description": "4B 1.2 Turnover Bidders will be required to have an average yearly turnover of a minimum of 140,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain.", "minimum": "4B.5.1- 4B5.3 Insurances Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions. It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below: The Contractor shall maintain in force with reputable insurers Employer's (Compulsory) Liability Insurance = GBP10m Public and Product Liability Insurance = GBP10m Professional Risk Indemnity Insurance = GBP2m In respect of any one incident and unlimited as to numbers of claims" }, { "type": "technical", "description": "4C.1.2 Previous Experience Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice." } ] }, "submissionTerms": { "languages": [ "en" ], "bidValidityPeriod": { "durationInDays": 180 } }, "classification": { "id": "38000000", "scheme": "CPV" }, "hasRecurrence": false }, "language": "EN", "description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32491. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ A summary of the expected community benefits has been provided as follows: Please see Procurement documents for full details (SC Ref:818603) The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32491. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 (SC Ref:839270)", "links": [ { "rel": "canonical", "href": "https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839270" } ], "noticetype": "PCS Notice - Website Contract Notice" }