--- title: "Supply and Delivery of Swept Laser Source for PIC Measurements 1060nm & 632nm" ocid: "ocds-r6ebe6-0000839272" canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839272" markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839272.md" json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839272.json" source: "Public Contracts Scotland" current_stage: "Tender" buyer: "University of Strathclyde" published: "2026-08-06" --- # Supply and Delivery of Swept Laser Source for PIC Measurements 1060nm & 632nm Buyer: University of Strathclyde Current stage: Tender OCID: ocds-r6ebe6-0000839272 [View canonical contract page](https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839272) [Download OCDS JSON](https://d3tenders.com/contract/ocds-r6ebe6-0000839272.json) ## Summary The University of Strathclyde is buying swept laser sources for photonic integrated circuit (PIC) measurements at wavelengths of 1060nm and 632nm. The equipment supports the National Centre for Advanced Semiconductor Packaging, an industry-led scale-up facility intended to connect UK device design with domestic semiconductor packaging, testing and metrology. This is a supply contract for specialist photonics and semiconductor measurement equipment, rather than general laboratory supplies. Delivery is required in Glasgow. The requirement may suit manufacturers, specialist distributors and systems suppliers of swept laser sources, particularly those serving photonics, optical communications, semiconductor research or precision measurement facilities. Suppliers should be able to provide the specified equipment and support additional deliveries where required, including partial replacement or extensions to existing supplies and installations. The procurement reached tender: the University invited offers using an open procedure, with electronic submission. Bids were due by 25 August 2026 at 12:00 UTC, with bid opening scheduled for the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The authority may also request additional deliveries, including partial replacement of supplies or installations and extensions to existing supplies or installations. Variants are not allowed, and bids must remain valid for 180 days after the submission deadline. Evaluation includes economic and technical requirements. Bidders need average annual turnover of at least £180,000 over the previous three years and three examples of relevant experience delivering the equipment. Required insurance includes employers’ and public/product liability cover of £10 million each, plus £2 million professional indemnity cover. This opportunity is aimed at suppliers with established capability in swept laser sources, photonic integrated circuit measurement, optical testing or semiconductor metrology. Strong candidates are likely to combine product expertise with the capacity to supply, install or extend specialist equipment in a research and industrial scale-up environment. Relevant previous delivery experience is essential: bidders must provide three examples showing they can deliver the required equipment. The requirement also favours financially established businesses able to demonstrate sustained turnover and maintain substantial employers’, public and product liability, and professional indemnity insurance. Suppliers should be prepared to support the equipment through maintenance and warranty arrangements, as renewal may be required, and to fulfil further supply or replacement requirements during the relationship. Electronic ordering and payment arrangements may support established equipment suppliers and specialist distributors. ## Notice Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for Swept Laser Sources for PIC Measurements 1060nm & 632nm. ### Lot Information Lot 1 Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for Swept Laser Sources for PIC Measurements 1060nm & 632nm. Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option. Renewal: 12 months (if required maintenance and warranty) ## Key Details | Field | Value | | --- | --- | | Publication source | Public Contracts Scotland | | Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561719 | | Notice type | PCS Notice - Website Contract Notice | | Procurement type | Standard | | Procurement category | Goods | | Procurement method | Open | | Procurement method details | Open procedure | | Tender suitability | Not specified | | Awardee scale | Not specified | | All stages | Tender | ## Dates | Field | Value | | --- | --- | | Publication date | 6 Aug 2026 | | Submission deadline | 25 Aug 2026 | | Future notice date | Not specified | | Award date | Not specified | | Contract period | Not specified | | Recurrence | Not specified | ## Values | Field | Value | | --- | --- | | Tender value | Not specified | | Lots value | Not specified | | Awards value | Not specified | | Contracts value | Not specified | ## Status | Field | Value | | --- | --- | | Tender status | Active | | Lots status | Active | | Awards status | Not specified | | Contracts status | Not specified | ## Buyer | Field | Value | | --- | --- | | Main buyer | University of Strathclyde | | Locality | GLASGOW | | Postcode area | Glasgow | | Postcode | G1 1XU | | Country | Scotland | | ITL 1 | TLM Scotland | | ITL 2 | TLM3 West Central Scotland | | ITL 3 | TLM32 Glasgow City | | Local authority | Glasgow City | | Electoral ward | Anderston/City/Yorkhill | | Westminster constituency | Glasgow North East | | Delivery location | TLM82 Glasgow City | ## CPV Codes ### Divisions - 38 - Laboratory, optical and precision equipments (excl. glasses) ### Codes - 38000000 - Laboratory, optical and precision equipments (excl. glasses) ## Release History - 6 Aug 2026 at 01:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561719 ## Documents - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561719 Supply and Delivery of Swept Laser Source for PIC Measurements 1060nm & 632nm - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for Swept Laser Sources for PIC Measurements 1060nm & 632nm. ## Notice URLs - http:// - http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343 - http://www.publictendersscotland.publiccontractsscotland.gov.uk - http://www.strath.ac.uk/ - https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839272 - https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/ - https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html ## Provenance This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839272. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839272.json.