---
title: "Supply, Delivery and Installation of Matrix Plasma Asher"
ocid: "ocds-r6ebe6-0000839464"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839464"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839464.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839464.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "University of Strathclyde"
published: "2026-08-06"
---

# Supply, Delivery and Installation of Matrix Plasma Asher

Buyer: University of Strathclyde  
Current stage: Tender  
OCID: ocds-r6ebe6-0000839464

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## Summary

The University of Strathclyde is procuring the supply, delivery and installation of a Matrix Plasma Asher for the National Centre for Advanced Semiconductor Packaging in Glasgow. The equipment will support an integrated, industry-led facility for advanced semiconductor packaging, test and metrology, helping UK photonics and power-electronics innovators move from device design to domestic, high-volume packaging. The requirement is for goods, with associated installation. The wider purpose is to reduce reliance on overseas outsourced semiconductor assembly and test facilities, shorten lead times, reduce intellectual-property leakage risk and strengthen domestic supply-chain resilience. This opportunity suits manufacturers, specialist equipment suppliers and authorised distributors able to provide a Matrix Plasma Asher and install it in a semiconductor packaging environment.

The process reached tender: the University invited offers through an open procedure, with electronic submission. The buyer set the tender deadline at 9 September 2026, 12:00 UTC, with bids opened at that time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The authority may also request additional deliveries for partial replacement or extensions to existing supplies and installations. Award evaluation is weighted 60% quality and 40% price. Bids must remain valid for 180 days and be submitted in English; variants are not allowed. Economic requirements include average annual turnover of at least £446,000 over the last three years and insurance of £10 million employers’ liability, £10 million public and product liability, and £2 million professional indemnity.

This opportunity is suited to suppliers with direct experience supplying, delivering and installing plasma ashing equipment for semiconductor, photonics, power-electronics, research or advanced manufacturing facilities. Bidders must provide three examples demonstrating relevant experience in delivering the specified equipment, so established equipment manufacturers, specialist integrators and technically capable authorised distributors are best placed to compete. The requirement calls for sufficient engineering and after-sales capacity to manage delivery, installation, maintenance and warranty support over the contract period and any renewal. Suppliers must be able to meet the stated insurance levels or commit to obtaining them before contract commencement, and should have the financial scale to satisfy the turnover threshold. The project also includes community-benefit requirements.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561751 |
| Notice type | OJEU - F2 - Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 6 Aug 2026 |
| Submission deadline | 9 Sep 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | University of Strathclyde |
| Locality | GLASGOW |
| Postcode area | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 6 Aug 2026 at 01:00 - Tender - OJEU - F2 - Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561751

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561751
  Supply, Delivery and Installation of Matrix Plasma Asher - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for a Matrix Plasma Asher.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839464
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839464. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839464.json.