---
title: "Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm"
ocid: "ocds-r6ebe6-0000839470"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839470"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839470.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839470.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "University of Strathclyde"
published: "2026-08-06"
---

# Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm

Buyer: University of Strathclyde  
Current stage: Tender  
OCID: ocds-r6ebe6-0000839470

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## Summary

The University of Strathclyde is buying and having delivered a swept laser source for photonic integrated circuit (PIC) measurements at 1550 nm. This is a specialised scientific instrument supporting the National Centre for Advanced Semiconductor Packaging, an industry-led facility intended to connect UK device design with domestic semiconductor packaging, testing and metrology. The requirement is classified as laboratory and scientific equipment. The work is for delivery in Glasgow. There is one lot, covering the equipment supply and delivery, with the possibility of additional deliveries for partial replacement or extensions to existing supplies and installations. The buyer is a public university and central purchasing body.

The procurement reached tender: the University invited offers through an open procedure, with bids submitted electronically. The submission deadline and bid opening were set for 25 August 2026 at 12:00 UTC; evaluation was scheduled to start at that time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. Bids must remain valid for 180 days and be submitted in English. The buyer requires average annual turnover of at least GBP 150,000 over the previous three years. Required insurance levels are GBP 10 million employers’ liability, GBP 10 million public and product liability, and GBP 2 million professional risk indemnity. Evaluation includes economic capacity and technical experience, including three relevant examples.

This opportunity suits suppliers of swept laser sources, photonic measurement equipment and related semiconductor or optical laboratory systems. The successful supplier will need to provide equipment suitable for PIC measurements at the 1550 nm wavelength, deliver it to Glasgow and support the associated supply, installation or replacement requirements. Suppliers should be able to demonstrate three comparable examples showing relevant experience in delivering the specified equipment. They also need the financial resilience and insurance arrangements required for a substantial specialist equipment contract, including employers’, public and product liability, and professional risk indemnity cover. Firms able to provide ongoing maintenance and warranty support may be well placed because renewal is linked to those requirements.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561770 |
| Notice type | PCS Notice - Website Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 6 Aug 2026 |
| Submission deadline | 25 Aug 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | University of Strathclyde |
| Locality | GLASGOW |
| Postcode area | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 6 Aug 2026 at 01:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561770

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561770
  Supply and Delivery of Swept Laser Source for PIC Measurements 1550nm - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Swept Laser Source for PIC Measurements 1550nm.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.publictendersscotland.publiccontractsscotland.gov.uk
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839470
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839470. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839470.json.