---
title: "Supply, Delivery and Installation of Rapid Thermal Anneal"
ocid: "ocds-r6ebe6-0000839501"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839501"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839501.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000839501.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "University of Strathclyde"
published: "2026-08-06"
---

# Supply, Delivery and Installation of Rapid Thermal Anneal

Buyer: University of Strathclyde  
Current stage: Tender  
OCID: ocds-r6ebe6-0000839501

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## Summary

The University of Strathclyde is buying the supply, delivery and installation of a Rapid Thermal Anneal system for the National Centre for Advanced Semiconductor Packaging. The equipment will support an integrated, industry-led scale-up facility for advanced semiconductor packaging, linking UK device design with domestic high-volume packaging, testing and metrology. The wider purpose is to reduce reliance on overseas outsourced semiconductor assembly and test facilities, shorten lead times, reduce intellectual property leakage risk and protect the supply chain from geopolitical disruption. This is a goods requirement for specialist laboratory, optical and precision equipment (CPV 38000000). Delivery and installation are in Glasgow. The procurement is a single requirement, and the University of Strathclyde is the buying organisation and central purchasing body.

The process reached tender: the University invited offers through an open procedure, with electronic submission. The bid deadline set by the buyer is 26 August 2026 at 12:00 UTC, with bid opening at the same time. The contract period is 720 days, with a possible 12-month renewal where maintenance and warranty are required. The buyer may also request additional deliveries for partial replacement or extensions of existing supplies and installations. Bids must remain valid for 180 days and be submitted in English; variants are not allowed. Evaluation requires three relevant previous-experience examples. Bidders must have average annual turnover of at least GBP 226,000 over the last three years and meet insurance requirements of GBP 10 million employer’s liability, GBP 10 million public and product liability, and GBP 2 million professional risk indemnity.

This opportunity suits equipment manufacturers, specialist laboratory technology suppliers and integrators able to provide a Rapid Thermal Anneal system as a complete supply, delivery and installation package. Strong candidates will understand semiconductor processing and the operational requirements of advanced packaging, testing or metrology environments, and will be able to demonstrate three comparable deliveries. The requirement is suited to an established supplier with the technical team, installation capability and supply-chain resilience to support a national scale-up facility. Experience delivering complex precision equipment into research, industrial or semiconductor settings will be particularly relevant. Suppliers should also be prepared to provide maintenance and warranty support, manage potential replacement or extension deliveries, and operate effective electronic ordering, payment and invoicing arrangements.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Rapid Thermal Anneal.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Rapid Thermal Anneal.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561812 |
| Notice type | PCS Notice - Website Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 6 Aug 2026 |
| Submission deadline | 26 Aug 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | University of Strathclyde |
| Locality | GLASGOW |
| Postcode area | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 6 Aug 2026 at 01:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561812

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=AUG561812
  Supply, Delivery and Installation of Rapid Thermal Anneal - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a Rapid Thermal Anneal.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.publictendersscotland.publiccontractsscotland.gov.uk
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000839501
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000839501. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000839501.json.