---
title: "Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector"
ocid: "ocds-r6ebe6-0000843030"
canonical_url: "https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000843030"
markdown_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000843030.md"
json_url: "https://d3tenders.com/contract/ocds-r6ebe6-0000843030.json"
source: "Public Contracts Scotland"
current_stage: "Tender"
buyer: "University of Strathclyde"
published: "2026-09-15"
---

# Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector

Buyer: University of Strathclyde  
Current stage: Tender  
OCID: ocds-r6ebe6-0000843030

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## Summary

The University of Strathclyde is buying a field-programmable gate array (FPGA)-based configurable multi-instrument source and detector, classified under CPV 38000000 for laboratory, optical and precision equipment. This is a goods requirement supporting the National Centre for Advanced Semiconductor Packaging (NCASP), an industry-led facility intended to connect UK device design with domestic semiconductor packaging, testing and measurement. The equipment is intended for use in Glasgow. The wider purpose is to support advanced photonics and power-electronics development, scale-up and high-volume packaging by providing configurable source and detector capability within a sovereign, open-access semiconductor facility. The requirement includes supply and delivery, with potential further deliveries for partial replacement, extensions or additions to the original equipment and installations.

The procurement reached tender: the University invited offers through an open procedure, with electronic submission in English. The bid deadline and bid opening were 18 September 2026 at 12:00 UTC. The contract period is 720 days, with a possible 12-month renewal for required maintenance and warranty. The authority may request additional deliveries, replacements or extensions at its discretion. Bids must remain valid for 180 days. Evaluation requires three examples of relevant previous experience. Bidders need average annual turnover of at least £140,000 over the last three years and must hold or obtain employer’s liability insurance of £10 million, public and product liability insurance of £10 million, and professional indemnity insurance of £2 million. Electronic ordering and payment apply, and electronic invoicing is permitted.

This opportunity suits suppliers of specialist electronic, laboratory, optical or semiconductor test equipment with proven FPGA-based instrumentation capability. Strong candidates will be able to configure, supply, deliver and support a multi-instrument source and detector for advanced research and semiconductor packaging applications, and demonstrate three comparable equipment-delivery projects. The requirement is suited to established businesses with sufficient financial resilience and a supply chain capable of supporting equipment and installations over the contract term, including possible replacement or extension work. Suppliers must be able to meet the specified employer’s, public and product liability, and professional indemnity insurance levels. The opportunity may also suit manufacturers, authorised distributors or specialist integrators able to provide maintenance and warranty support, electronic ordering and payment, and associated technical assistance.

## Notice

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

### Lot Information

Lot 1

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.

Renewal: 12 months (if required maintenance and warranty)

## Key Details

| Field | Value |
| --- | --- |
| Publication source | Public Contracts Scotland |
| Latest notice | https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=SEP564548 |
| Notice type | PCS Notice - Website Contract Notice |
| Procurement type | Standard |
| Procurement category | Goods |
| Procurement method | Open |
| Procurement method details | Open procedure |
| Tender suitability | Not specified |
| Awardee scale | Not specified |
| All stages | Tender |

## Dates

| Field | Value |
| --- | --- |
| Publication date | 15 Sep 2026 |
| Submission deadline | 18 Sep 2026 |
| Future notice date | Not specified |
| Award date | Not specified |
| Contract period | Not specified |
| Recurrence | Not specified |

## Values

| Field | Value |
| --- | --- |
| Tender value | Not specified |
| Lots value | Not specified |
| Awards value | Not specified |
| Contracts value | Not specified |

## Status

| Field | Value |
| --- | --- |
| Tender status | Active |
| Lots status | Active |
| Awards status | Not specified |
| Contracts status | Not specified |

## Buyer

| Field | Value |
| --- | --- |
| Main buyer | University of Strathclyde |
| Locality | GLASGOW |
| Postcode area | Glasgow |
| Postcode | G1 1XU |
| Country | Scotland |
| ITL 1 | TLM Scotland |
| ITL 2 | TLM3 West Central Scotland |
| ITL 3 | TLM32 Glasgow City |
| Local authority | Glasgow City |
| Electoral ward | Anderston/City/Yorkhill |
| Westminster constituency | Glasgow North East |
| Delivery location | TLM82 Glasgow City |

## CPV Codes

### Divisions

- 38 - Laboratory, optical and precision equipments (excl. glasses)

### Codes

- 38000000 - Laboratory, optical and precision equipments (excl. glasses)

## Release History

- 15 Sep 2026 at 01:00 - Tender - PCS Notice - Website Contract Notice - https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=SEP564548

## Documents

- https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=SEP564548
  Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector - Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology - reducing time-to-market and anchoring value onshore. Description University of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.

## Notice URLs

- http://
- http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343
- http://www.strath.ac.uk/
- https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000843030
- https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/
- https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html

## Provenance

This Markdown file is an alternate public rendering of the D3 Tenders contract record. The canonical page is https://d3tenders.com/contract/?ocid=ocds-r6ebe6-0000843030. The underlying structured data is available as OCDS JSON at https://d3tenders.com/contract/ocds-r6ebe6-0000843030.json.