Award

Laser Dicing and Drilling System

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

This public procurement record has 2 releases in its history.

Award

21 Apr 2022 at 10:26

Award Notice
Tender

17 Aug 2021 at 13:16

Tender Notice
Summary of the contracting process

The procurement process involves the Compound Semiconductor Applications Catapult Limited seeking suppliers for a Laser Dicing and Drilling System. This tender falls under the category of laboratory, optical, and precision equipment, with an estimated contract value ranging from £250,000 to £350,000. The tender was published on 17th August 2021 and the submission deadline for interested parties is 31st August 2021. The anticipated contract period spans from 20th September 2021 to 19th September 2025, and delivery will be required to take place in January 2022. This procurement is conducted through an open, accelerated procedure to facilitate an efficient response timeframe.

This opportunity presents potential growth avenues for businesses specialising in precision manufacturing, specifically those providing equipment or technologies related to semiconductor processing. Companies with expertise in laser systems, automation, or bespoke manufacturing solutions would be well-positioned to compete for this contract. Engaging in this tender could enable suppliers to establish a long-term partnership with a leading organisation in the semiconductor industry, fostering innovation and advancing capabilities in prototype assembly and testing.

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Notice Information

Notice Title

Laser Dicing and Drilling System

Notice Description

Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications. The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 40:1 with high-quality edge finish and minimum taper angle (preferably 90-degree cut). The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming. System Outline The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated. A system solution is required that is flexible and upgradable in the future. Additional information: The estimated value of the contract is PS250,000 to PS350,000 including goods to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of December 2021 delivered in January 2022. To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-053 in the subject field.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-b5fd17-0d815bc4-882b-4961-aad7-606c9eb123e9
Publication Source
Contracts Finder
Latest Notice
https://www.contractsfinder.service.gov.uk/Notice/947b34d2-ec28-464f-92d1-696cee327b55
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Accelerated Open procedure (above threshold)
Tender Suitability
SME
Awardee Scale
Large

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£350,000 £100K-£500K
Lots Value
Not specified
Awards Value
£295,000 £100K-£500K
Contracts Value
Not specified

Notice Dates

Publication Date
21 Apr 20223 years ago
Submission Deadline
31 Aug 2021Expired
Future Notice Date
Not specified
Award Date
10 Oct 20214 years ago
Contract Period
10 Oct 2021 - 10 Oct 2025 4-5 years
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Not Specified
Awards Status
Active
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
NEWPORT
Postcode
NP10 8BE
Post Town
Newport
Country
Wales
Major Region (ITL 1)
TLL Wales
Basic Region (ITL 2)
TLL5 South East Wales
Small Region (ITL 3)
TLL54 Monmouthshire and Newport
Delivery Location
TLL Wales
Local Authority
Newport
Electoral Ward
Tredegar Park and Marshfield
Westminster Constituency
Newport West and Islwyn

Supplier Information

Number of Suppliers
1
Supplier Name

M-SOLV

Further Information

Notice Documents

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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