Notice Information
Notice Title
Sub-Micron Bonder
Notice Description
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As part of the package assembly research and development methodology we require a machine to perform sub-micron die placement for several growth areas in compound semiconductor packaging. This machine shall be capable of handling very small die in applications where their precision placement is a high priority; typical examples of this are micro LED's, laser diode assembly, micro optics assembly, VCSEL, photo diode arrays, III-V semiconductor die attachment to ROIC (hybridisation) and image sensor assembly. This shall also support future technology growth areas in packaging such as 2.5D and 3D IC packaging, multi-chip modules, flex on board and chip on glass. Capability to have optional upgrades, such as integration of active alignment for photonics device assembly would be advantageous. The equipment shall be flexible and have several technologies available to mount die onto a substrate: dispensing, sintering, thermocompression bonding UV curing and ultrasonic bonding. Other process modules to support die placement and processing would include die heating and substrate heating, a process gas module for applications like formic acid etching for low temperature bumping, mechanical handling of parts and a module to support high bonding forces. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support The system architecture is expected to be a standalone machine with a number of modules and tool options to allow the micro assembly of die with a sub-micron placement accuracy. The system shall provide user-controlled interface for the assembly of die into devices for RF, Photonics and Power packaging. The system should have capability to be used for both prototype device and low volume production quantities. The system shall be easy to configure and change for the user to allow different processes. A system solution is required that is flexible and upgradeable in the future. Additional module options can then be purchased based on changing industry trends or specific requirements from customers or partners for technology development. The system should also include user software, installation, and training. Additional information: Please note that the equipment will be required to be delivered to the laboratory in Newport, Wales, by the end of December 2020. To express interest in this requirement and receive the tender documents, please email procurement@csa.catapult.org.uk with the reference ITC-2020-037 in the subject field.
Notice Details
Publication & Lifecycle
- Open Contracting ID
- ocds-b5fd17-87061cf9-cb28-4b0d-83ea-c7dbfb61b59a
- Publication Source
- Contracts Finder
- Latest Notice
- https://www.contractsfinder.service.gov.uk/Notice/cc87ecec-23a4-46ba-8101-01fb90143951
- Current Stage
- Tender
- All Stages
- Tender
Procurement Classification
- Notice Type
- Tender Notice
- Procurement Type
- Standard
- Procurement Category
- Goods
- Procurement Method
- Open
- Procurement Method Details
- Open procedure (above threshold)
- Tender Suitability
- SME
- Awardee Scale
- Not specified
Common Procurement Vocabulary (CPV)
- CPV Divisions
31 - Electrical machinery, apparatus, equipment and consumables; lighting
38 - Laboratory, optical and precision equipments (excl. glasses)
-
- CPV Codes
31710000 - Electronic equipment
38000000 - Laboratory, optical and precision equipments (excl. glasses)
Notice Value(s)
- Tender Value
- £450,000 £100K-£500K
- Lots Value
- Not specified
- Awards Value
- Not specified
- Contracts Value
- Not specified
Notice Dates
- Publication Date
- 14 Jul 20205 years ago
- Submission Deadline
- 13 Aug 2020Expired
- Future Notice Date
- Not specified
- Award Date
- Not specified
- Contract Period
- 18 Dec 2020 - 17 Dec 2023 2-3 years
- Recurrence
- Not specified
Notice Status
- Tender Status
- Active
- Lots Status
- Not Specified
- Awards Status
- Not Specified
- Contracts Status
- Not Specified
Buyer & Supplier
Contracting Authority (Buyer)
- Main Buyer
- COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
- Contact Name
- Available with D3 Tenders Premium →
- Contact Email
- Available with D3 Tenders Premium →
- Contact Phone
- Available with D3 Tenders Premium →
Buyer Location
- Locality
- NEWPORT
- Postcode
- NP10 8BE
- Post Town
- Newport
- Country
- Wales
-
- Major Region (ITL 1)
- TLL Wales
- Basic Region (ITL 2)
- TLL5 South East Wales
- Small Region (ITL 3)
- TLL54 Monmouthshire and Newport
- Delivery Location
- Not specified
-
- Local Authority
- Newport
- Electoral Ward
- Tredegar Park and Marshfield
- Westminster Constituency
- Newport West and Islwyn
Further Information
Notice Documents
-
https://www.contractsfinder.service.gov.uk/Notice/cc87ecec-23a4-46ba-8101-01fb90143951
14th July 2020 - Opportunity notice on Contracts Finder
Open Contracting Data Standard (OCDS)
View full OCDS Record for this contracting process
The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts.
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