Award

Die Bonder

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

This public procurement record has 3 releases in its history.

AwardUpdate

26 Jul 2019 at 12:14

Award Notice
Award

26 Jul 2019 at 10:18

Award Notice
Tender

05 Apr 2019 at 10:32

Tender Notice
Summary of the contracting process

The Compound Semiconductor Applications Catapult Limited is conducting a procurement process for a project titled "Die Bonder," aimed at creating a flexible prototype package assembly and test facility for RF, Photonics, and Power semiconductor devices. The tender is classified under the category of laboratory, optical, and precision equipment, with a procurement value of £180,000. The procurement method is an open procedure, and the tender period concluded on 7th May 2019. The contract period commenced on 24th May 2019 and is set to end on 23rd May 2022. The project will be located within the Advanced Packaging Laboratory at the CSA Catapult's Innovation Centre in Cardiff, Wales.

This procurement presents a significant opportunity for businesses in the laboratory equipment and research sectors, particularly those specialising in advanced packaging technologies and semiconductor materials. Small and medium-sized enterprises (SMEs) are encouraged to participate, as the procurement is designed to accommodate their capabilities for manual and semi-automatic die bonding processes. Companies that can provide adaptable bonding equipment and related research and development services would be well-suited to compete for this contract, potentially leading to fruitful collaborations and business growth within the expanding aerospace and electronics industries.

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Notice Information

Notice Title

Die Bonder

Notice Description

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions. The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation. The Catapult may also purchase additional, related services. Additional information: To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-027 in the subject field.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-b5fd17-9cb3bcea-4d98-4485-98f0-efaa85198b95
Publication Source
Contracts Finder
Latest Notice
https://www.contractsfinder.service.gov.uk/Notice/e9a381d2-39b0-40a2-a6cd-4eb7e6a5d966
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure (above threshold)
Tender Suitability
SME
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£180,000 £100K-£500K
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
26 Jul 20196 years ago
Submission Deadline
7 May 2019Expired
Future Notice Date
Not specified
Award Date
18 Jun 20196 years ago
Contract Period
19 Jun 2019 - 19 Jun 2022 3-4 years
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Not Specified
Awards Status
Active
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Contact Name
Not specified
Contact Email
procurement@csa.catapult.org.uk
Contact Phone
Not specified

Buyer Location

Locality
CARDIFF
Postcode
CF10 4RU
Post Town
Cardiff
Country
Wales
Major Region (ITL 1)
TLL Wales
Basic Region (ITL 2)
TLL5 South East Wales
Small Region (ITL 3)
TLL52 Cardiff and Vale of Glamorgan
Delivery Location
Not specified
Local Authority
Cardiff
Electoral Ward
Butetown
Westminster Constituency
Cardiff South and Penarth

Supplier Information

Number of Suppliers
1
Supplier Name

INSETO (UK

Further Information

Notice Documents

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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