Award

UK SBS PR19072 Flip Chip Aligner

UK SHARED BUSINESS SERVICES LIMITED

This public procurement record has 2 releases in its history.

Award

07 Jan 2020 at 15:34

Award Notice
Tender

04 Oct 2019 at 13:16

Tender Notice
Summary of the contracting process

The procurement process involves the UK Shared Business Services Limited, which has published a tender for the "UK SBS PR19072 Flip Chip Aligner". This is in the microelectronic machinery and apparatus industry, located in Swindon, England. The current stage of this tender is complete, with a contract awarded to SET Corporation SA. The procurement method used was an open procedure, with a value of £1,000,000 and a minimum value of £500,000. Key dates include the submission deadline for bids, which was 8th November 2019, and the contract period spanning from 17th December 2019 to 31st July 2020.

This tender presents significant opportunities for businesses specialising in advanced manufacturing and microelectronics, particularly those that can provide flip chip bonding and assembly capabilities. Companies that are well-suited to compete include SMEs with experience in electronics, high-value manufacturing, or those focusing on custom machinery solutions. With the assembly facility undergoing a major upgrade, there is potential for future projects that require innovative assembly processes and technologies, making this an attractive prospect for growth-oriented businesses in this sector.

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Notice Information

Notice Title

UK SBS PR19072 Flip Chip Aligner

Notice Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) develop detectors to cover a broad range of scientific measurement in the X-Ray, infrared, visible light, neutron, gamma ray parts of the EM spectrum. UKRI-STFC require a flip chip bonder which will perform the assembly of such a range of radiation sensitive detectors. The detectors generally consist of a 2D array of complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC), bonded to a geometrically similar 2D array of solid-state sensor material to form a hybrid pixel sensor. In many cases, the ROIC is silicon, but often the sensor is selected to provide specific detection properties for the radiation range being sensed. This means that a wide variety of sensor materials are possible, including but not limited to silicon, germanium, cadmium telluride, cadmium zinc telluride, gallium arsenide and gallium antimonide. Most of the projects are small volume (1-5 units), high value runs, but it is also required to perform higher volume assemblies of a few 10s, 100s or potentially 2000-3000 units. Small volume runs must be accommodated by creating breaks during larger runs, necessitating rapid turn reconfigurations. The assembly facility is currently going through a major upgrade and will be moving into new custom built premises and looking to build on that improvement by enhancing the bonding and assembly capabilities. Floor space has been allocated with service provision installed for a typical flip chip bonder. UKRI-STFC has an established flip chip and die placement capability which utilises a range of bond processes but there is a recognised need to future proof the assembly infrastructure, increase the capacity and provide for making process enhancements to enable assembling higher numbers of more densely packed pixels. There are also plans to extend the range of processes which can be supported in the future, giving the ability to offer more than the current core flip chip processes. Please refer to the specification for the full requirement. Additional information: Please Note: Do not apply directly to the Buyer. Please disregard any content in this notice that requests your organisation "to apply directly to the buyer" as this unfortunately a system generated error, that is outside of the Contracting Authorities control.The final date and time for the submission of bids is 08/11/2019 at 1100hrs GMT. All submissions will be assessed in accordance with the Public Contracts Regulations 2015, for procurement values that exceed Regulation 5 (Threshold amounts). The contracting authority shall utilise the Delta eSourcing Procurement Tool available at https://uksbs.delta-esourcing.com/ to conduct this procurement. All enquiries with respect to problems or functionality within the tool may be submitted to Delta eSourcing on 0845 270 7050. Please utilise the messaging system within the e-sourcing tool at the above link. Please note this is a free self-registration website and this can be done by completing the online questionnaire at https://uksbs.delta-esourcing.com/

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-b5fd17-ab6e825a-28b9-45c8-9019-948040cbc45f
Publication Source
Contracts Finder
Latest Notice
https://www.contractsfinder.service.gov.uk/Notice/f05aad6e-3e2a-4138-9041-c229b0a7b434
Current Stage
Award
All Stages
Tender, Award

Procurement Classification

Notice Type
Award Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure (above threshold)
Tender Suitability
SME
Awardee Scale
SME

Common Procurement Vocabulary (CPV)

CPV Divisions

31 - Electrical machinery, apparatus, equipment and consumables; lighting

CPV Codes

31712100 - Microelectronic machinery and apparatus

Notice Value(s)

Tender Value
£1,000,000 £1M-£10M
Lots Value
Not specified
Awards Value
£899,801 £500K-£1M
Contracts Value
Not specified

Notice Dates

Publication Date
7 Jan 20206 years ago
Submission Deadline
8 Nov 2019Expired
Future Notice Date
Not specified
Award Date
20 Dec 20196 years ago
Contract Period
2 Jan 2020 - 31 Jul 2020 6-12 months
Recurrence
Not specified

Notice Status

Tender Status
Complete
Lots Status
Not Specified
Awards Status
Active
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
UK SHARED BUSINESS SERVICES LIMITED
Contact Name
Available with D3 Tenders Premium →
Contact Email
Available with D3 Tenders Premium →
Contact Phone
Available with D3 Tenders Premium →

Buyer Location

Locality
SWINDON
Postcode
SN2 1FF
Post Town
Swindon
Country
England
Major Region (ITL 1)
TLK South West (England)
Basic Region (ITL 2)
TLK7 Gloucestershire and Wiltshire
Small Region (ITL 3)
TLK71 Swindon
Delivery Location
Not specified
Local Authority
Swindon
Electoral Ward
Rodbourne Cheney
Westminster Constituency
Swindon North

Supplier Information

Number of Suppliers
1
Supplier Name

SET

Further Information

Notice Documents

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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