Tender

Laser Dicing and Drilling System

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

This public procurement record has 1 release in its history.

Tender

30 Apr 2021 at 12:07

Tender Notice
Summary of the contracting process

The Compound Semiconductor Applications Catapult Limited is currently conducting a tender for the procurement of a "Laser Dicing and Drilling System," primarily aimed at the laboratory, optical, and precision equipment industry in Wales, United Kingdom. This open procurement process, classified under the goods category, has a tender period ending on 1st June 2021. The estimated contract value is between £250,000 and £350,000, and the contract period is scheduled from 22nd June 2021 to 21st June 2025. Interested suppliers should express their interest by emailing the provided contact point to obtain procurement documents.

This tender presents a significant opportunity for businesses specialising in high-precision manufacturing and equipment supply, particularly those with capabilities in semiconductor integration and modular equipment development. Businesses that are agile and can provide innovative solutions, along with installation and training services, would be well-suited to compete for this contract, allowing them to expand their market presence and potentially benefit from ongoing research and development collaborations within the semiconductor sector.

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Notice Information

Notice Title

Laser Dicing and Drilling System

Notice Description

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications. The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 20:1 (preferably 50:1 if applicable) with high-quality edge finish and minimum taper angle (preferably 90-degree cut). The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming. The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated. A system solution is required that is flexible and upgradable in the future. Additional information: The estimated value of the contract is PS250,000 to PS350,000 including good to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of September delivered in October 2021. To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-047 in the subject field.

Notice Details

Publication & Lifecycle

Open Contracting ID
ocds-b5fd17-fa6996c2-24d0-4604-bd47-ea0bd80c4161
Publication Source
Contracts Finder
Latest Notice
https://www.contractsfinder.service.gov.uk/Notice/20ef4af9-8846-4b2b-be82-f99c9070e18c
Current Stage
Tender
All Stages
Tender

Procurement Classification

Notice Type
Tender Notice
Procurement Type
Standard
Procurement Category
Goods
Procurement Method
Open
Procurement Method Details
Open procedure (above threshold)
Tender Suitability
SME
Awardee Scale
Not specified

Common Procurement Vocabulary (CPV)

CPV Divisions

38 - Laboratory, optical and precision equipments (excl. glasses)

CPV Codes

38000000 - Laboratory, optical and precision equipments (excl. glasses)

Notice Value(s)

Tender Value
£350,000 £100K-£500K
Lots Value
Not specified
Awards Value
Not specified
Contracts Value
Not specified

Notice Dates

Publication Date
30 Apr 20214 years ago
Submission Deadline
1 Jun 2021Expired
Future Notice Date
Not specified
Award Date
Not specified
Contract Period
21 Jun 2021 - 21 Jun 2025 4-5 years
Recurrence
Not specified

Notice Status

Tender Status
Active
Lots Status
Not Specified
Awards Status
Not Specified
Contracts Status
Not Specified

Buyer & Supplier

Contracting Authority (Buyer)

Main Buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Contact Name
Not specified
Contact Email
procurement@csa.catapult.org.uk
Contact Phone
Not specified

Buyer Location

Locality
NEWPORT
Postcode
NP10 8BE
Post Town
Newport
Country
Wales
Major Region (ITL 1)
TLL Wales
Basic Region (ITL 2)
TLL5 South East Wales
Small Region (ITL 3)
TLL54 Monmouthshire and Newport
Delivery Location
TLL Wales
Local Authority
Newport
Electoral Ward
Tredegar Park and Marshfield
Westminster Constituency
Newport West and Islwyn

Further Information

Notice Documents

Open Contracting Data Standard (OCDS)

View full OCDS Record for this contracting process

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The Open Contracting Data Standard (OCDS) is a framework designed to increase transparency and access to public procurement data in the public sector. It is widely used by governments and organisations worldwide to report on procurement processes and contracts. 

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